According to the latest report by IMARC Group, titled "Organic Substrate Packaging Material Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2021-2026," the global organic substrate packaging materials market size witnessed moderate growth during 2015-2020. Organic substrate packaging materials refer to the base materials that are used in semiconductor applications and manufacturing. They are utilized on the foundation layer of printed circuit boards (PCBs) to act as a conductive interconnect between semiconductors and PCBs. They offer exceptional reliability and enhanced electrical performance while facilitating heat, signal and power distribution. They are also lightweight in nature, which enables them to reduce the weight of PCBs, thereby improving their functionality and dimensional control. They are widely composed of organic small molecules or polymers that are polycyclic aromatic compounds. Their utilization aids in reducing the overall environmental impact of PCBs effectively.
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Global Organic Substrate Packaging Material Market Trends:
The global market is primarily driven by the increasing uptake of portable electronic devices and an enhanced focus on sustainable development. With the increasing digitization across numerous industries and the rising penetration of affordable consumer electronics, there has been a growing requirement for organic substrate packaging materials across the globe. Moreover, continual advancements in information and communication technology (ICT) and the rising preference for miniature electronic devices across various industry sectors are also acting as major growth-inducing factors. The market is further driven by the widespread utilization of organic substrate packaging materials in the manufacturing of millimeter-wave automotive radar systems for self-driving automobiles. Some of the other factors contributing to the market include significant growth in the semiconductor industry and the rising employment of these materials in system configuration and integration across multiple sectors. On account of the aforementioned factors, the market is expected to grow at a CAGR of 5% during 2021-2026.
- Based on the technology, the market has been divided into Small Outline (SO) packages, Grid Array (GA) packages, flat no-leads packages, Quad Flat Package (QFP), Dual in-line Package (GIP), and others.
- On the basis of the application, the market has been classified into consumer electronics, automotive, manufacturing, healthcare, and others.
- On the geographical front, the market has been segregated into North America (the United States and Canada), Europe (Germany, France, the United Kingdom, Italy, Spain, Russia and others), Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia and others), Latin America (Brazil, Mexico and others), and Middle East and Africa.
- The competitive landscape of the market has been studied in the report with the detailed profiles of the key players. Some of these players include Amkor Technology Inc., ASE Kaohsiung (Advanced Semiconductor Engineering Inc.), Compass Technology Co. Ltd., Hitachi Chemical Company Ltd. (Hitachi and Showa Denko), Kyocera Corporation, Mitsubishi Corporation, NGK Spark Plug Co. Ltd., Shinko Electric Industries Co. Ltd. (Fujitsu), STATS ChipPAC Pte. Ltd. (Jiangsu Changjiang Electronics Tech. Co.) and WUS Printed Circuit Co. Ltd.
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