Advanced IC Substrate Market

Market Overview:

The global advanced IC substrate market size reached US$ 9.4 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 13.8 Billion by 2028, exhibiting a growth rate (CAGR) of 6.2% during 2023-2028.

Advanced integrated circuit (IC) substrate is a baseboard used to connect the printed circuit boards (PCBs) to the semiconductor chips. It is compact, durable, lightweight, energy-efficient, and cost-effective and exhibits high thermal dissipation performance. In addition, it provides high reliability and outstanding electrical properties, reduces the overall weight of PCBs, and increases their functionality and dimensional control. As a result, it is currently widely used for manufacturing miniaturized electronic products with the latest functions.

Advanced IC Substrate Market Trends:

The escalating demand for miniaturized consumer electronic products, such as tablets, laptops, smartphones, and personal computers (PCs), represents one of the key factors impelling the market growth. Moreover, the rising need for remote-controlled electrical equipment in industrial applications is contributing to the market growth. Apart from this, defense departments in various countries rely on several microelectronics, such as nuclear-armed bombers, submarines, intercontinental ballistic missiles, and space-based sensors, to make deterrence strategies that protect deployed forces, allies, and partners. Furthermore, as sensitive microelectronics are vulnerable to high levels of ionizing radiation, defense agencies are deploying advanced IC substrates to protect them in hazardous conditions. Besides this, a wide range of applications of handheld, portable, and implantable medical electronic devices in the diagnosis and treatment of various critical diseases is catalyzing the demand for advanced IC substrates in the healthcare industry. In line with this, the growing trend of cars with driverless and safety features and innovative infotainment systems are contributing to the adoption of advanced IC substrates in the automotive industry. This can also be accredited with efforts undertaken by governing agencies of numerous countries to promote green, electric vehicles (EVs) and minimize greenhouse (GHG) emissions of automobiles.

Key Market Segmentation:

IMARC Group provides an analysis of the key trends in each sub-segment of the global advanced IC substrate market report, along with forecasts at the global, regional and country level from 2023-2028. Our report has categorized the market based on type and application.

Breakup by Type:

• FC BGA
• FC CSP
   

Breakup by Application:

• Consumer Electronics
• Automotive and Transportation
• IT and Telecom
• Others
   

Breakup by Region:

• North America
  • United States
  • Canada
• Asia-Pacific
  • China
  • Japan
  • India
  • South Korea
  • Australia
  • Indonesia
  • Others
• Europe
  • Germany
  • France
  • United Kingdom
  • Italy
  • Spain
  • Russia
  • Others
• Latin America
  • Brazil
  • Mexico
  • Others
• Middle East and Africa
   

Competitive Landscape:

The competitive landscape of the industry has also been examined along with the profiles of the key players being ASE Group, AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Fujitsu Limited, Ibiden Co. Ltd., JCET Group Co. Ltd, Kinsus Interconnect Technology Corp., Korea Circuit Co. Ltd., KYOCERA Corporation, LG Innotek Co. Ltd., Nan Ya PCB Co. Ltd. (Nan Ya Plastics Corporation), TTM Technologies Inc. and Unimicron Technology Corporation (United Microelectronics Corporation).

Report Coverage: