Market Overview:
The Asia Pacific radiation-hardened electronics market size reached US$ 337.1 Million in 2023. Looking forward, IMARC Group expects the market to reach US$ 467.1 Million by 2032, exhibiting a growth rate (CAGR) of 3.58% during 2024-2032.
Report Attribute
|
Key Statistics
|
Base Year
|
2023
|
Forecast Years
|
2024-2032
|
Historical Years
|
2018-2023
|
Market Size in 2023
|
US$ 337.1 Million |
Market Forecast in 2032
|
US$ 467.1 Million |
Market Growth Rate (2024-2032) |
3.58% |
Radiation-hardened electronics refer to electronic components that are resistant to damages caused by radiation emitted by nuclear reactors. They are made using gallium nitride, silicon carbide and hydrogenated amorphous silicon and primarily utilized for high-altitude applications. As a result, they are employed in aircraft, satellites and nuclear power plants across the Asia Pacific region.
The rising number of commercial space projects represents one of the significant factors driving the market in the Asia Pacific region. Moreover, radiation-hardened electronics have the capability to withstand high temperature and radiation levels present in nuclear reactors, which is positively influencing their overall sales. Other factors contributing to the market growth include the flourishing semiconductor industry across the region. However, the sudden coronavirus disease (COVID-19) outbreak has impelled governments of several regional countries to impose lockdown restrictions. This has disrupted the supply chains and manufacturing operations of various leading players and negatively impacted the overall market growth. It is anticipated to recover the incurred losses once governing agencies introduce lockdown relaxations.
Key Market Segmentation:
IMARC Group provides an analysis of the key trends in each segment of the Asia Pacific radiation-hardened electronics market report, along with forecasts at the regional and country levels from 2024-2032. Our report has categorized the market based on product type, material type, technique, component type and application.
Breakup by Product Type:
- Custom Made
- Commercial-Off-the-Shelf
Breakup by Material Type:
- Silicon
- Silicon Carbide
- Gallium Nitride
- Others
Breakup by Technique:
- Radiation Hardening by Design (RHBD)
- Radiation Hardening by Process (RHBP)
- Radiation Hardening by Software (RHBS)
Breakup by Component Type:
- Power Management
- Application Specific Integrated Circuit
- Logic
- Memory
- Field-Programmable Gate Array
- Others
Breakup by Application:
- Space Satellites
- Commercial Satellites
- Military
- Aerospace and Defense
- Nuclear Power Plants
- Others
Breakup by Country:
- China
- Japan
- India
- South Korea
- Australia
- Indonesia
- Others
Competitive Landscape:
The competitive landscape of the industry has also been examined along with the profiles of the key players.
Report Coverage:
Report Features |
Details |
Base Year of the Analysis |
2023 |
Historical Period |
2018-2023 |
Forecast Period |
2024-2032 |
Units |
US$ Million |
Segment Coverage |
Product Type, Material Type, Technique, Component type, Application, Country |
Countries Covered |
China, Japan, India, South Korea, Australia, Indonesia, Others |
Customization Scope |
10% Free Customization |
Report Price and Purchase Option |
Single User License: US$ 3699
Five User License: US$ 4699
Corporate License: US$ 5699 |
Post-Sale Analyst Support |
10-12 Weeks |
Delivery Format |
PDF and Excel through Email (We can also provide the editable version of the report in PPT/Word format on special request) |
Key Questions Answered in This Report:
- How has the Asia Pacific radiation-hardened electronics market performed so far and how will it perform in the coming years?
- What has been the impact of COVID-19 on the Asia Pacific radiation-hardened electronics market?
- What are the key regional markets?
- What is the breakup of the market based on the product type?
- What is the breakup of the market based on the material type?
- What is the breakup of the market based on the technique?
- What is the breakup of the market based on the component type?
- What is the breakup of the market based on the application?
- What are the various stages in the value chain of the industry?
- What are the key driving factors and challenges in the industry?
- What is the structure of the Asia Pacific radiation-hardened electronics market and who are the key players?
- What is the degree of competition in the industry?