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The global e-beam wafer inspection system market reached a value of US$ 461 Million in 2020. Looking forward, IMARC Group expects the market to grow at a CAGR of around 21% during 2021-2026. Keeping in mind the uncertainties of COVID-19, we are continuously tracking and evaluating the direct as well as the indirect influence of the pandemic on different end use industries. These insights are included in the report as a major market contributor.
E-beam wafer inspection system refers to a semiconductor fabrication tool based on electron beam scanning of integrated circuit (IC) components or wafers. It is used for detecting any defects in the wafers before final packaging and is ideal for scanning small sections of a die to identify specific hard-to-detect systematic and random defects. The inspection system scans the wafer and determines coordinates of the defects by comparing it to the image of the adjacent dies. This technique is commonly used while manufacturing compact gadgets, smartphones, laptops and tablets. It is also used for lithographic qualification, wafer dispositioning and reticle quality optimization.
Significant growth in the electronics industry, along with rapid industrialization, is one of the key factors creating a positive outlook for the market. Semiconductor wafers are widely used for manufacturing specialized devices and consumer electronics, thereby increasing the demand for efficient inspection systems. Furthermore, the electrification and automation in automobiles is also driving the market growth. Numerous kinds of wafers are used in automobile components, such as airbag controls, global positioning systems (GPS), anti-lock braking systems (ABS), navigation and display systems and power down and window controls. They are also used for improving automated driving and collision detection technologies, which, in turn, have increased the demand for wafer inspection systems. Moreover, various technological advancements, such as the development of multi-beam e-beam inspection systems that are more efficient and minimize the overall time required for mass production, are projected to drive the market further.
Breakup by Resolution:
Breakup by Application:
Breakup by End Use:
Breakup by Region:
The report has also analysed the competitive landscape of the market with some of the key players being Aerotech Inc., Applied Materials Inc., ASML Holding N.V., Hitachi Ltd., KLA-Tener Corporation, Lam Research Corporation, Nanotronics Imaging Inc., NXP Semiconductors N.V. (Qualcomm Incorporated), Renesas Electronics Corporation, Synopsys Inc., Taiwan Semiconductor and Teledyne Technologies.
|Base Year of the Analysis||2020|
|Segment Coverage||Resolution, Application, End Use, Region|
|Region Covered||Asia Pacific, Europe, North America, Latin America, Middle East and Africa|
|Countries Covered||United States, Canada, Germany, France, United Kingdom, Italy, Spain, Russia, China, Japan, India, South Korea, Australia, Indonesia, Brazil, Mexico|
|Companies Covered||Aerotech Inc., Applied Materials Inc., ASML Holding N.V., Hitachi Ltd., KLA-Tener Corporation, Lam Research Corporation, Nanotronics Imaging Inc., NXP Semiconductors N.V. (Qualcomm Incorporated), Renesas Electronics Corporation, Synopsys Inc., Taiwan Semiconductor and Teledyne Technologies|
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