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Embedded Die Packaging Technology Market by Platform (Embedded Die in IC Package Substrate, Embedded Die in Rigid Board, Embedded Die in Flexible Board), Industry Vertical (Consumer Electronics, IT and Telecommunication, Automotive, Healthcare, and Others), and Region 2023-2028

Market Overview:

The global embedded die packaging technology market size reached US$ 81.0 Million in 2022. Looking forward, IMARC Group expects the market to reach US$ 176.89 Million by 2028, exhibiting a growth rate (CAGR) of 12.80% during 2023-2028.

Embedded die packaging technology is used to embed components inside the substrate via a multi-step manufacturing process. It comprises flip-chip chip scale packaging (FC CSP) and wafer-level chip scale packaging (WL CSP) to improve the efficiency of the system. It creates more space for other components by shrinking overall solutions in the printed circuit board (PCB). It also provides surface-mount technology (SMT) integration and a flexible routing solution to reduce printed circuit board (PCB) size. It offers design flexibility that shifts from 2D to 3D while reducing distortion and power loss. As a result, embedded die packaging technology finds extensive application in electronics, information and technology (IT), automotive, healthcare, and telecommunication industries across the globe.

Embedded Die Packaging Technology Market Trends:

At present, there is an increase in the miniaturization of electronic circuits in microelectronic devices around the world. This, along with the burgeoning semiconductor industry, represents one of the key factors driving the market. Moreover, embedded die packaging technology offers several benefits, such as upgraded electrical and thermal performance, heterogeneous integration, and streamlined logistics for original equipment manufacturers (OEMs), which are contributing to the growth of the market. In addition, the increasing adoption of autonomous robots for professional services in various industries is offering lucrative growth opportunities to industry investors. Besides this, the growing utilization of embedded die packaging technology in smartphones and wearable devices to enhance the available space and integrate more components is positively influencing the market. Additionally, there is a rise in the demand for embedded die packaging technology with integrated internet of things (IoT) across the globe. This, coupled with the increasing sales of portable electronic devices, such as laptops, computers, tablets, e-readers, smartphones, MP3 players, drones, and electronic toys, is bolstering the growth of the market.

Key Market Segmentation:

IMARC Group provides an analysis of the key trends in each sub-segment of the global embedded die packaging technology market report, along with forecasts at the global, regional and country level from 2023-2028. Our report has categorized the market based on platform and industry vertical.

Breakup by Platform:

  • Embedded Die in IC Package Substrate
  • Embedded Die in Rigid Board
  • Embedded Die in Flexible Board
     

Breakup by Industry Vertical:

  • Consumer Electronics
  • IT and Telecommunication
  • Automotive
  • Healthcare
  • Others
     

Breakup by Region:

  • North America
    • United States
    • Canada
  • Asia-Pacific
    • China
    • Japan
    • India
    • South Korea
    • Australia
    • Indonesia
    • Others
  • Europe
    • Germany
    • France
    • United Kingdom
    • Italy
    • Spain
    • Russia
    • Others
  • Latin America
    • Brazil
    • Mexico
    • Others
  • Middle East and Africa
     

Competitive Landscape:

The competitive landscape of the industry has also been examined along with the profiles of the key players being Amkor Technology Inc., ASE Technology Holding Co. Ltd., AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Fujikura Ltd., Infineon Technologies AG, Microsemi Corporation (Microchip Technology Inc.), Schweizer Electronic AG and TDK Electronics AG (TDK Corporation). Kindly, note that this only represents a partial list of companies, and the complete list has been provided in the report.

Report Coverage:

Report Features Details
Base Year of the Analysis 2022
    Historical Period 2017-2022
Forecast Period 2023-2028
Units US$ Million
Segment Coverage Platform, Industry Vertical, Region
Region Covered  Asia Pacific, Europe, North America, Latin America, Middle East and Africa
Countries Covered United States, Canada, Germany, France, United Kingdom, Italy, Spain, Russia, China, Japan, India, South Korea, Australia, Indonesia, Brazil, Mexico
Companies Covered Amkor Technology Inc., ASE Technology Holding Co. Ltd., AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Fujikura Ltd., Infineon Technologies AG, Microsemi Corporation (Microchip Technology Inc.), Schweizer Electronic AG and TDK Electronics AG (TDK Corporation).
Customization Scope 10% Free Customization
Report Price and Purchase Option Single User License: US$ 2499
Five User License: US$ 3499
Corporate License: US$ 4499
Post-Sale Analyst Support 10-12 Weeks
Delivery Format PDF and Excel through Email (We can also provide the editable version of the report in PPT/Word format on special request)

 

Key Questions Answered in This Report:

  • How has the global embedded die packaging technology market performed so far and how will it perform in the coming years?
  • What has been the impact of COVID-19 on the global embedded die packaging technology market?
  • What are the key regional markets?
  • What is the breakup of the market based on the platform?
  • What is the breakup of the market based on the industry vertical?
  • What are the various stages in the value chain of the industry?
  • What are the key driving factors and challenges in the industry?
  • What is the structure of the global embedded die packaging technology market and who are the key players?
  • What is the degree of competition in the industry?
     

Key Benefits for Stakeholders:

  • IMARC’s report offers a comprehensive quantitative analysis of various market segments, historical and current market trends, market forecasts, and dynamics of the embedded die packaging technology market from 2017-2028.
  • The research study provides the latest information on the market drivers, challenges, and opportunities in the global embedded die packaging technology market.
  • The study maps the leading as well as the fastest growing regional markets. It further enables stakeholders to identify the key country-level markets within each region.
  • Porter's five forces analysis assist stakeholders in assessing the impact of new entrants, competitive rivalry, supplier power, buyer power, and the threat of substitution. It helps stakeholders to analyze the level of competition within the embedded die packaging technology industry and its attractiveness.
  • Competitive landscape allows stakeholders to understand their competitive environment and  provides an insight into the current positions of key players in the market.

1    Preface
2    Scope and Methodology

    2.1    Objectives of the Study
    2.2    Stakeholders
    2.3    Data Sources
        2.3.1    Primary Sources
        2.3.2    Secondary Sources
    2.4    Market Estimation
        2.4.1    Bottom-Up Approach
        2.4.2    Top-Down Approach
    2.5    Forecasting Methodology
3    Executive Summary
4    Introduction

    4.1    Overview
    4.2    Key Industry Trends
5    Global Embedded Die Packaging Technology Market
    5.1    Market Overview
    5.2    Market Performance
    5.3    Impact of COVID-19
    5.4    Market Forecast
6    Market Breakup by Platform
    6.1    Embedded Die in IC Package Substrate
        6.1.1 Market Trends
        6.1.2 Market Forecast
    6.2    Embedded Die in Rigid Board
        6.2.1 Market Trends
        6.2.2 Market Forecast
    6.3    Embedded Die in Flexible Board
        6.3.1 Market Trends
        6.3.2 Market Forecast
7    Market Breakup by Industry Vertical
    7.1    Consumer Electronics
        7.1.1 Market Trends
        7.1.2 Market Forecast
    7.2    IT and Telecommunication
        7.2.1 Market Trends
        7.2.2 Market Forecast
    7.3    Automotive
        7.3.1 Market Trends
        7.3.2 Market Forecast
    7.4    Healthcare
        7.4.1 Market Trends
        7.4.2 Market Forecast
    7.5    Others
        7.5.1 Market Trends
        7.5.2 Market Forecast
8    Market Breakup by Region
    8.1    North America
        8.1.1 United States
           8.1.1.1 Market Trends
           8.1.1.2 Market Forecast
        8.1.2 Canada
           8.1.2.1 Market Trends
           8.1.2.2 Market Forecast
    8.2    Asia-Pacific
        8.2.1 China
           8.2.1.1 Market Trends
           8.2.1.2 Market Forecast
        8.2.2 Japan
           8.2.2.1 Market Trends
           8.2.2.2 Market Forecast
        8.2.3 India
           8.2.3.1 Market Trends
           8.2.3.2 Market Forecast
        8.2.4 South Korea
           8.2.4.1 Market Trends
           8.2.4.2 Market Forecast
        8.2.5 Australia
           8.2.5.1 Market Trends
           8.2.5.2 Market Forecast
        8.2.6 Indonesia
           8.2.6.1 Market Trends
           8.2.6.2 Market Forecast
        8.2.7 Others
           8.2.7.1 Market Trends
           8.2.7.2 Market Forecast
    8.3    Europe
        8.3.1 Germany
           8.3.1.1 Market Trends
           8.3.1.2 Market Forecast
        8.3.2 France
           8.3.2.1 Market Trends
           8.3.2.2 Market Forecast
        8.3.3 United Kingdom
           8.3.3.1 Market Trends
           8.3.3.2 Market Forecast
        8.3.4 Italy
           8.3.4.1 Market Trends
           8.3.4.2 Market Forecast
        8.3.5 Spain
           8.3.5.1 Market Trends
           8.3.5.2 Market Forecast
        8.3.6 Russia
           8.3.6.1 Market Trends
           8.3.6.2 Market Forecast
        8.3.7 Others
           8.3.7.1 Market Trends
           8.3.7.2 Market Forecast
    8.4    Latin America
        8.4.1 Brazil
           8.4.1.1 Market Trends
           8.4.1.2 Market Forecast
        8.4.2 Mexico
           8.4.2.1 Market Trends
           8.4.2.2 Market Forecast
        8.4.3 Others
           8.4.3.1 Market Trends
           8.4.3.2 Market Forecast
    8.5    Middle East and Africa
        8.5.1 Market Trends
        8.5.2 Market Breakup by Country
        8.5.3 Market Forecast
9    SWOT Analysis
    9.1    Overview
    9.2    Strengths
    9.3    Weaknesses
    9.4    Opportunities
    9.5    Threats
10    Value Chain Analysis
11    Porters Five Forces Analysis

    11.1    Overview
    11.2    Bargaining Power of Buyers
    11.3    Bargaining Power of Suppliers
    11.4    Degree of Competition
    11.5    Threat of New Entrants
    11.6    Threat of Substitutes
12    Price Analysis
13    Competitive Landscape

    13.1    Market Structure
    13.2    Key Players
    13.3    Profiles of Key Players
        13.3.1    Amkor Technology Inc.
           13.3.1.1 Company Overview
           13.3.1.2 Product Portfolio
           13.3.1.3 Financials
           13.3.1.4 SWOT Analysis
        13.3.2    ASE Technology Holding Co. Ltd.
           13.3.2.1 Company Overview
           13.3.2.2 Product Portfolio
           13.3.2.3 Financials
        13.3.3    AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
           13.3.3.1 Company Overview
           13.3.3.2 Product Portfolio
           13.3.3.3 Financials
        13.3.4    Fujikura Ltd.
           13.3.4.1 Company Overview
           13.3.4.2 Product Portfolio
           13.3.4.3 Financials
           13.3.4.4 SWOT Analysis
        13.3.5    Infineon Technologies AG
           13.3.5.1 Company Overview
           13.3.5.2 Product Portfolio
           13.3.5.3 Financials
           13.3.5.4 SWOT Analysis
        13.3.6    Microsemi Corporation (Microchip Technology Inc.)
           13.3.6.1 Company Overview
           13.3.6.2 Product Portfolio
           13.3.6.3 SWOT Analysis
        13.3.7    Schweizer Electronic AG
           13.3.7.1 Company Overview
           13.3.7.2 Product Portfolio
           13.3.7.3 Financials
        13.3.8    TDK Electronics AG (TDK Corporation)
           13.3.8.1 Company Overview
           13.3.8.2 Product Portfolio

Kindly, note that this only represents a partial list of companies, and the complete list has been provided in the report

List of Figures

Figure 1: Global: Embedded Die Packaging Technology Market: Major Drivers and Challenges
Figure 2: Global: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017-2022
Figure 3: Global: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 4: Global: Embedded Die Packaging Technology Market: Breakup by Platform (in %), 2022
Figure 5: Global: Embedded Die Packaging Technology Market: Breakup by Industry Vertical (in %), 2022
Figure 6: Global: Embedded Die Packaging Technology Market: Breakup by Region (in %), 2022
Figure 7: Global: Embedded Die Packaging Technology (Embedded Die in IC Package Substrate) Market: Sales Value (in Million US$), 2017 & 2022
Figure 8: Global: Embedded Die Packaging Technology (Embedded Die in IC Package Substrate) Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 9: Global: Embedded Die Packaging Technology (Embedded Die in Rigid Board) Market: Sales Value (in Million US$), 2017 & 2022
Figure 10: Global: Embedded Die Packaging Technology (Embedded Die in Rigid Board) Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 11: Global: Embedded Die Packaging Technology (Embedded Die in Flexible Board) Market: Sales Value (in Million US$), 2017 & 2022
Figure 12: Global: Embedded Die Packaging Technology (Embedded Die in Flexible Board) Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 13: Global: Embedded Die Packaging Technology (Consumer Electronics) Market: Sales Value (in Million US$), 2017 & 2022
Figure 14: Global: Embedded Die Packaging Technology (Consumer Electronics) Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 15: Global: Embedded Die Packaging Technology (IT and Telecommunication) Market: Sales Value (in Million US$), 2017 & 2022
Figure 16: Global: Embedded Die Packaging Technology (IT and Telecommunication) Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 17: Global: Embedded Die Packaging Technology (Automotive) Market: Sales Value (in Million US$), 2017 & 2022
Figure 18: Global: Embedded Die Packaging Technology (Automotive) Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 19: Global: Embedded Die Packaging Technology (Healthcare) Market: Sales Value (in Million US$), 2017 & 2022
Figure 20: Global: Embedded Die Packaging Technology (Healthcare) Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 21: Global: Embedded Die Packaging Technology (Other Industry Verticals) Market: Sales Value (in Million US$), 2017 & 2022
Figure 22: Global: Embedded Die Packaging Technology (Other Industry Verticals) Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 23: North America: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
Figure 24: North America: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 25: United States: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
Figure 26: United States: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 27: Canada: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
Figure 28: Canada: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 29: Asia-Pacific: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
Figure 30: Asia-Pacific: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 31: China: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
Figure 32: China: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 33: Japan: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
Figure 34: Japan: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 35: India: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
Figure 36: India: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 37: South Korea: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
Figure 38: South Korea: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 39: Australia: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
Figure 40: Australia: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 41: Indonesia: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
Figure 42: Indonesia: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 43: Others: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
Figure 44: Others: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 45: Europe: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
Figure 46: Europe: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 47: Germany: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
Figure 48: Germany: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 49: France: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
Figure 50: France: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 51: United Kingdom: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
Figure 52: United Kingdom: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 53: Italy: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
Figure 54: Italy: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 55: Spain: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
Figure 56: Spain: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 57: Russia: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
Figure 58: Russia: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 59: Others: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
Figure 60: Others: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 61: Latin America: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
Figure 62: Latin America: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 63: Brazil: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
Figure 64: Brazil: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 65: Mexico: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
Figure 66: Mexico: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 67: Others: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
Figure 68: Others: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 69: Middle East and Africa: Embedded Die Packaging Technology Market: Sales Value (in Million US$), 2017 & 2022
Figure 70: Middle East and Africa: Embedded Die Packaging Technology Market: Breakup by Country (in %), 2022
Figure 71: Middle East and Africa: Embedded Die Packaging Technology Market Forecast: Sales Value (in Million US$), 2023-2028
Figure 72: Global: Embedded Die Packaging Technology Industry: SWOT Analysis
Figure 73: Global: Embedded Die Packaging Technology Industry: Value Chain Analysis
Figure 74: Global: Embedded Die Packaging Technology Industry: Porter's Five Forces Analysis

List of Tables

Table 1: Global: Embedded Die Packaging Technology Market: Key Industry Highlights, 2022 & 2028
Table 2: Global: Embedded Die Packaging Technology Market Forecast: Breakup by Platform (in Million US$), 2023-2028
Table 3: Global: Embedded Die Packaging Technology Market Forecast: Breakup by Industry Vertical (in Million US$), 2023-2028
Table 4: Global: Embedded Die Packaging Technology Market Forecast: Breakup by Region (in Million US$), 2023-2028
Table 5: Global: Embedded Die Packaging Technology Market: Competitive Structure
Table 6: Global: Embedded Die Packaging Technology Market: Key Players


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