Embedded Die Packaging Technology Market by Platform (Embedded Die in IC Package Substrate, Embedded Die in Rigid Board, Embedded Die in Flexible Board), Industry Vertical (Consumer Electronics, IT and Telecommunication, Automotive, Healthcare, and Others), and Region 2023-2028
The global embedded die packaging technologymarket size reached US$ 81.0 Million in 2022. Looking forward, IMARC Group expects the market to reach US$ 176.89 Million by 2028, exhibiting a growth rate (CAGR) of 12.80% during 2023-2028.
Embedded die packaging technology is used to embed components inside the substrate via a multi-step manufacturing process. It comprises flip-chip chip scale packaging (FC CSP) and wafer-level chip scale packaging (WL CSP) to improve the efficiency of the system. It creates more space for other components by shrinking overall solutions in the printed circuit board (PCB). It also provides surface-mount technology (SMT) integration and a flexible routing solution to reduce printed circuit board (PCB) size. It offers design flexibility that shifts from 2D to 3D while reducing distortion and power loss. As a result, embedded die packaging technology finds extensive application in electronics, information and technology (IT), automotive, healthcare, and telecommunication industries across the globe.
Embedded Die Packaging Technology Market Trends:
At present, there is an increase in the miniaturization of electronic circuits in microelectronic devices around the world. This, along with the burgeoning semiconductor industry, represents one of the key factors driving the market. Moreover, embedded die packaging technology offers several benefits, such as upgraded electrical and thermal performance, heterogeneous integration, and streamlined logistics for original equipment manufacturers (OEMs), which are contributing to the growth of the market. In addition, the increasing adoption of autonomous robots for professional services in various industries is offering lucrative growth opportunities to industry investors. Besides this, the growing utilization of embedded die packaging technology in smartphones and wearable devices to enhance the available space and integrate more components is positively influencing the market. Additionally, there is a rise in the demand for embedded die packaging technology with integrated internet of things (IoT) across the globe. This, coupled with the increasing sales of portable electronic devices, such as laptops, computers, tablets, e-readers, smartphones, MP3 players, drones, and electronic toys, is bolstering the growth of the market.
Key Market Segmentation:
IMARC Group provides an analysis of the key trends in each sub-segment of the global embedded die packaging technologymarket report, along with forecasts at the global, regional and country level from 2023-2028. Our report has categorized the market based on platform and industry vertical.
Breakup by Platform:
Embedded Die in IC Package Substrate
Embedded Die in Rigid Board
Embedded Die in Flexible Board
Breakup by Industry Vertical:
IT and Telecommunication
Breakup by Region:
Middle East and Africa
The competitive landscape of the industry has also been examined along with the profiles of the key players being Amkor Technology Inc., ASE Technology Holding Co. Ltd., AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Fujikura Ltd., Infineon Technologies AG, Microsemi Corporation (Microchip Technology Inc.), Schweizer Electronic AG and TDK Electronics AG (TDK Corporation). Kindly, note that this only represents a partial list of companies, and the complete list has been provided in the report.
Base Year of the Analysis
Platform, Industry Vertical, Region
Asia Pacific, Europe, North America, Latin America, Middle East and Africa
United States, Canada, Germany, France, United Kingdom, Italy, Spain, Russia, China, Japan, India, South Korea, Australia, Indonesia, Brazil, Mexico
Amkor Technology Inc., ASE Technology Holding Co. Ltd., AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Fujikura Ltd., Infineon Technologies AG, Microsemi Corporation (Microchip Technology Inc.), Schweizer Electronic AG and TDK Electronics AG (TDK Corporation).
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Key Benefits for Stakeholders:
IMARC’s report offers a comprehensive quantitative analysis of various market segments, historical and current market trends, market forecasts, and dynamics of the embedded die packaging technology market from 2017-2028.
The research study provides the latest information on the market drivers, challenges, and opportunities in the global embedded die packaging technology market.
The study maps the leading as well as the fastest growing regional markets. It further enables stakeholders to identify the key country-level markets within each region.
Porter's five forces analysis assist stakeholders in assessing the impact of new entrants, competitive rivalry, supplier power, buyer power, and the threat of substitution. It helps stakeholders to analyze the level of competition within the embedded die packaging technology industry and its attractiveness.
Competitive landscape allows stakeholders to understand their competitive environment and provides an insight into the current positions of key players in the market.
Key Questions Answered in This Report
The global embedded die packaging technology market was valued at US$ 81.0 Million in 2022.
We expect the global embedded die packaging technology market to exhibit a CAGR of 12.80% during 2023-2028.
The rising adoption of embedded die packaging technology in smartphones and wearable devices to enhance the available space and integrate more components is primarily driving the global embedded die packaging technology market.
The sudden outbreak of the COVID-19 pandemic had led to the implementation of stringent lockdown regulations across several nations, resulting in the temporary closure of various end-use industries for embedded die packaging technology.
Based on the platform, the global embedded die packaging technology market has been segregated into embedded die in IC package substrate, embedded die in rigid board, and embedded die in flexible board. Among these, embedded die in IC package substrate currently holds the largest market share.
Based on the industry vertical, the global embedded die packaging technology market can be bifurcated into consumer electronics, IT and telecommunication, automotive, healthcare, and others. Currently, the consumer electronics industry exhibits a clear dominance in the market.
On a regional level, the market has been classified into North America, Asia-Pacific, Europe, Latin America, and Middle East and Africa, where Asia-Pacific currently dominates the global market.
Some of the major players in the global embedded die packaging technology market include Amkor Technology Inc., ASE Technology Holding Co. Ltd., AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Fujikura Ltd., Infineon Technologies AG, Microsemi Corporation (Microchip Technology Inc.), Schweizer Electronic AG, and TDK Electronics AG (TDK Corporation).
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