Global Bare Die Shipping & Handling and Processing & Storage Market to Reach US$ 1,710.7 Million by 2032, Stimulated by Rising Sales of Electronic Devices

September 28, 2023 | Heavy Industry

According to the latest report by IMARC Group, titled “Bare Die Shipping & Handling and Processing & Storage Market Report by Product (Shipping Tubes, Trays, Carrier Tapes, and Others), Application (Communications, Computers, Consumer Electronics, Automotive, Industrial and Medical, Defense), and Region 2024-2032,” the global bare die shipping & handling and processing & storage market size reached US$ 1,073.8 Million in 2023. Bare die shipping, handling, processing, and storage involve various processes that are used in semiconductor manufacturing and supply chain management. They include careful packaging, labeling, and transportation of these fragile components from the manufacturer to various assembly and testing facilities. They ensure the safe and efficient transportation, preparation, and preservation of bare semiconductor dies, which are the core components of integrated circuits (ICs). They also involve preserving the integrity of bare dies before they are used in manufacturing. Besides this, they aid in ensuring the quality, reliability, and functionality of electronic devices that rely on semiconductors.

Global Bare Die Shipping & Handling and Processing & Storage Market Trends:

The rising reliance on electronic devices represents one of the key factors driving the need for efficient bare die handling and storage. Additionally, the widespread adoption of advanced packaging technologies, such as flip-chip and wafer-level packaging, is catalyzing the demand for specialized handling and processing techniques. Apart from this, the implementation of various stringent environmental regulations is encouraging the use of more sustainable packaging and storage methods. Furthermore, many semiconductor companies are outsourcing packaging and testing, which is increasing the reliance on efficient handling and processing services. Moreover, the expansion of data centers on account of cloud computing and digital transformation is driving the need for efficient bare die handling and storage solutions for server components. In addition, advancements in materials, sensors, and tracking technologies are enhancing the precision and control of handling and storage processes. Looking forward, the market value is projected to reach US$ 1,710.7 Million by 2032, expanding at a CAGR of 5.15% during 2024-2032.

Market Summary:

  • Based on the product, the market has been segmented into shipping tubes, trays, carrier tapes, and others. Trays currently dominate the overall market.  
  • On the basis of the application, the market has been classified into communications, computers, consumer electronics, automotive, industrial and medical, and defense. At present, communications represent the largest market segment.
  • Region-wise, the market has been segregated into North America (the United States and Canada); Asia-Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others); Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others); Latin America (Brazil, Mexico, and others); and the Middle East and Africa. Amongst these, North America enjoys the leading position in the market.
  • The competitive landscape of the market has also been examined, with some of the key players being Achilles Usa Inc. (The Achilles Corporation), Brooks Automation Inc., Entegris Inc., ePAK International Inc., Keaco LLC, Malaster Company Inc., and Ted Pella Inc.

Report Scope:

Report Features Details
Base Year of the Analysis 2023
Historical Period 2018-2023
Forecast Period 2024-2032
Units US$ Million
Scope of the Report Exploration of Historical and Forecast Trends, Industry Catalysts and Challenges, Segment-Wise Historical and Predictive Market Assessment: 
  • Product
  • Application
  • Region  
Products Covered Shipping Tubes, Trays, Carrier Tapes, Others
Applications Covered Communications, Computers, Consumer Electronics, Automotive, Industrial and Medical, Defense
Regions Covered  Asia Pacific, Europe, North America, Latin America, Middle East and Africa
Countries Covered United States, Canada, Germany, France, United Kingdom, Italy, Spain, Russia, China, Japan, India, South Korea, Australia, Indonesia, Brazil, Mexico
Companies Covered Achilles Usa Inc. (The Achilles Corporation), Brooks Automation Inc., Entegris Inc., ePAK International Inc., Keaco LLC, Malaster Company Inc., Ted Pella Inc., etc.
Customization Scope 10% Free Customization
Report Price and Purchase Option Single User License: US$ 3899
Five User License: US$ 4899
Corporate License: US$ 5899
Post-Sale Analyst Support 10-12 Weeks
Delivery Format PDF and Excel through Email (We can also provide the editable version of the report in PPT/Word format on special request)

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Global Bare Die Shipping & Handling and Processing & Storage Market to Reach US$ 1,710.7 Million by 2032, Stimulated by Rising Sales of Electronic Devices
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