Global Hybrid Memory Cube Market to Reach US$ 10,479.9 Million by 2032, Bolstered by Growing Digitization

February 15, 2022 | Technology & Media

The latest report by IMARC Group, titled “Hybrid Memory Cube Market Report by Product (2GB, 4GB, 8GB), Application (Graphics Processing Unit (GPU), Central Processing Unit (CPU), Accelerated Processing Unit (APU), Field-programmable Gate Array (FPGA), Application-specific Integrated Circuit (ASIC)), End Use Industry (Enterprise Storage, Telecommunications and Networking, and Others), and Region 2024-2032,” finds that the global hybrid memory cube market reached a value of US$ 1,599.0 Million in 2023. A hybrid memory cube (HMC) is a high-performance RAM interface that is designed for TSV (through-silicon via) based stacked dynamic RAM. It is a revolutionary technology that signifies a paradigm shift from current memory architectures by utilizing 70% less energy per bit than current DRAM technologies. HMC interfaces work for stacked DRAM memory, which is combined with a graphic processing unit (GPU). The system also allows for simultaneous access to several memory blocks and tends to use a separate processor like a chain to multiply the memory capacity of the device. The HMC overcomes bandwidth shortage by employing memory devices that deliver a prominent boost in performance. As a result, it finds applications in enterprise storage, telecommunications, and networking across the globe.

Global Hybrid Memory Cube Market Trends: 

The market is primarily driven by the increasing need for memories offering high bandwidth, low power consumption, and high scalability. Recently, the emergence of the Internet of Things (IoT) and Big Data applications like business analytics, scientific computing, financial transactions, social networking, and search engines are propelling the demand for technologies that effectively process and store a vast amount of information. This, in turn, is fueling the growth of HMC and other high bandwidth memory. In addition, HMC provides numerous applications for network and communication technology. It also offers increased performance in next-generation mainstream computing applications that enrich the user experience, thereby significantly impacting the market growth. Besides this, rapid urbanization and digitization are escalating the need for telecommunication technologies and advancement in transmitting, switching, processing, analyzing, and retrieving information, thus creating a positive outlook for the market. Looking forward, the market is expected to reach a value of US$ 10,479.9 Million by 2032, exhibiting a CAGR of 22.8% during the forecast period (2024-2032).

Market Summary: 

  • Based on the product, the market has been segmented into 2GB, 4GB, and 8GB.
  • On the basis of the application, the market has been classified into Graphics Processing Unit (GPU), Central Processing Unit (CPU), Accelerated Processing Unit (APU), Field-programmable Gate Array (FPGA), and Application-specific Integrated Circuit (ASIC).
  • The market has been categorized based on the end use industry into enterprise storage, telecommunications and networking, and others.
  • Region-wise, the market has been divided into North America (the United States and Canada), Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others), Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others), Latin America (Brazil, Mexico, and others), and Middle East and Africa.
  • The competitive landscape of the market has been examined, with some of the key players being Achronix Semiconductor Corporation, Arira Design Inc., Arm Limited, Fujitsu Limited, Intel Corporation, International Business Machines Corporation, Micron Technology Inc., NVIDIA Corporation, Open-Silicon Inc. (SiFive Inc.), Samsung Electronics Corporation Limited, Semtech Corporation, and Xilinx Inc.

Report Scope:

Report Features Details
Base Year of the Analysis 2023
Historical Period 2018-2023
Forecast Period 2024-2032
Units US$ Million
Segment Coverage Product, Application, End Use Industry, Region
Region Covered  Asia Pacific, Europe, North America, Latin America, Middle East and Africa
Countries Covered United States, Canada, Germany, France, United Kingdom, Italy, Spain, Russia, China, Japan, India, South Korea, Australia, Indonesia, Brazil, Mexico
Companies Covered Achronix Semiconductor Corporation, Arira Design Inc., Arm Limited, Fujitsu Limited, Intel Corporation, International Business Machines Corporation, Micron Technology Inc., NVIDIA Corporation, Open-Silicon Inc. (SiFive Inc.), Samsung Electronics Co. Ltd., Semtech Corporation and Xilinx Inc.
Customization Scope 10% Free Customization
Report Price and Purchase Option Single User License: US$ 3899
Five User License: US$ 4899
Corporate License: US$ 5899
Post-Sale Analyst Support 10-12 Weeks
Delivery Format PDF and Excel through Email (We can also provide the editable version of the report in PPT/Word format on special request)

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Global Hybrid Memory Cube Market to Reach US$ 10,479.9 Million by 2032, Bolstered by Growing Digitization
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