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Global Semiconductor Manufacturing Equipment Market to Reach US$ 145.32 Billion by 2027, Propelled by Expanding Electronics Industry

Published on Feb 03, 2022

As per the latest report by IMARC Group, titled “Semiconductor Manufacturing Equipment Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2022-2027,” the global semiconductor manufacturing equipment market size reached US$ 81.14 Billion in 2021. Semiconductor manufacturing equipment refers to the processing machinery used to produce various electronic and integrated circuits (ICs). It can be classified into wafer fabrication and assembly equipment. Wafer fabrication equipment is used in the early stages of the semiconductor manufacturing process, whereas testing and assembly equipment is used in the latter stages. These machines offer various benefits, such as streamlined production, improved yield and reliability, minimal manufacturing errors and enhanced workplace safety. As a result, they find extensive applications in various industries such as automotive, electronics, and robotics.

We are regularly tracking the direct effect of COVID-19 on the market, along with the indirect influence of associated industries. These observations will be integrated into the report.

Global Semiconductor Manufacturing Equipment Market Trends:

The market is primarily driven by the expanding electronics industry as semiconductors are widely utilized in consumer electronics, such as smartphones, tablets and laptops. In addition, the increasing demand for hybrid and electronic vehicles (H/EVs) represents another major growth-inducing factor. Semiconductor manufacturing equipment is used to assemble multiple semiconductors on a single chip to reduce electronic interference and provide enhanced protection to electronic devices. Besides this, several key players are introducing advanced product variants to expand their customer base. For instance, Applied Materials, Inc., a manufacturing company based in the US, launched Actionable Insight Accelerator (Alx), a platform that accelerates the manufacturing and production of new chip technologies. This, coupled with various technological advancements, such as the utilization of artificial intelligence (AI) solutions and the integration of connected devices with the Internet of Things (IoT), are positively influencing the market growth. Moreover, the emerging trend of device miniaturization and extensive research and development (R&D) activities are some of the other factors anticipated to propel the market growth in the coming years. Looking forward, IMARC Group expects the market value to reach US$ 145.32 Billion by 2027, expanding at a CAGR of 10% during the forecast period (2022-2027).

Market Summary:

·Based on equipment type, the market has been bifurcated into front-end and back-end.

·On the basis of front-end equipment, the market has been classified into lithography, deposition, cleaning, water surface conditioning, and others.

·Based on back-end equipment, the market has been categorized into testing, assembly and packaging, dicing, bonding, metrology, and others.

·On the basis of the fab facility, the market has been segmented into automation, chemical control, gas control, and others.

·The market has been segregated based on the product type into memory, logic components, microprocessors, analog components, optoelectronic components, discrete components, others.

·Based on the dimension, the market has been divided into 2D, 2.5D, and 3D.

·On the basis of the supply chain participant, the market has been classified into IDM firms, OSAT companies, and foundries.

·Region-wise, the market has been divided into Asia Pacific (Taiwan, China, Japan, India, South Korea, Singapore and others), North America (the United States and Canada), Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others), Latin America (Brazil, Mexico, and others), and Middle East and Africa.

·The report has also analyzed the competitive landscape of the market, with some of the key players being Advantest Corporation, Applied Materials Inc., ASML Holdings N.V., KLA Corporation, Lam Research Corporation, Onto Innovation Inc., Plasma-Therm LLC, SCREEN Holdings Co. Ltd., Teradyne Inc., Tokyo Electron Limited and Toshiba Corporation.

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