According to the latest report by IMARC Group, titled “Wafer Level Packaging Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2022-2027,” the global wafer level packaging market reached a value of US$ 4.0 Billion in 2021. Wafer-level packaging (WLP) is a technological solution that assists in adding protective layers and electronic connections to the substrate before dicing. It also aids in reducing the chip size, streamlining the process of manufacturing, and testing the functionality of the chip. Besides this, it minimizes the cost of electrical testing, manages the inventory and enhances the overall performance. As a result, WLP is extensively utilized in devices, such as pressure sensors and microphones, across the globe.
We are regularly tracking the direct effect of COVID-19 on the market, along with the indirect influence of associated industries. These observations will be integrated into the report.
Global Wafer Level Packaging Market Trends:
The thriving electronics industry, in confluence with significant investments in the infrastructure, represents one of the key factors driving the market. WLPs provide enhanced mechanical protection, structural support, and extended battery life to the devices. As a result, the demand for these cost-effective and high-performance packaging solutions is escalating around the world. Furthermore, leading manufacturers are incorporating connected devices with advanced technological solutions, such as the Internet of Things (IoT), which is creating a favorable market outlook. Consequently, WLP is employed in the production of self-driving automobiles and numerous wearable devices worldwide. Besides this, there is a considerable increase in the demand for portable consumer electronic devices. This, along with the growing circuit miniaturization in microelectronic devices, and the rising need for compact and faster consumer electronics, is anticipated to positively influence the market. Looking forward, IMARC Group expects the market is expected to exhibit a CAGR of 18.8% during the forecast period (2022-2027).
- Based on the packaging technology, the market has been divided into 3D TSV WLP, 2.5D TSV WLP, WLCSP, Nano WLP, and others.
- On the basis of the end use industry, the market has been segmented into aerospace and defense, consumer electronics, information technology (IT) and telecommunication, healthcare, automotive, and others.
- Region-wise, the market has been classified into North America (the United States and Canada); Asia Pacific (Japan, China, India, South Korea, Australia, Indonesia, and others); Europe (the United Kingdom, Germany, France, Italy, Spain, Russia, and others); Latin America (Brazil, Mexico, and others); and Middle East and Africa.
- The competitive landscape of the market has been examined, with some of the key players being Amkor Technology Inc., China Wafer Level CSP Co. Ltd., Chipbond Technology Corporation, Deca Technologies Inc. (Infineon Technologies AG), Fujitsu Limited, IQE PLC, JCET Group Co. Ltd., Siliconware Precision Industries Co. Ltd. (Advanced Semiconductor Engineering Inc.), Tokyo Electron Ltd. and Toshiba Corporation.
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