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Wafer Level Packaging Market Report by Packaging Technology (3D TSV WLP, 2.5D TSV WLP, WLCSP, Nano WLP, and Others), End Use Industry (Aerospace and Defense, Consumer Electronics, IT & Telecommunication, Healthcare, Automotive, and Others), and Region 2024-2032
Report Format: PDF+Excel | Report ID: SR112024A3283
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Market Overview:
The global wafer level packaging market size reached US$ 5.7 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 22.5 Billion by 2032, exhibiting a growth rate (CAGR) of 16.1% during 2024-2032.
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Report Attribute
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Key Statistics
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|---|---|
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Base Year
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2023
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Forecast Years
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2024-2032
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Historical Years
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2018-2023
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Market Size in 2023
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US$ 5.7 Billion |
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Market Forecast in 2032
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US$ 22.5 Billion |
| Market Growth Rate 2024-2032 | 16.1% |
The wafer-level packaging (WLP) refers to a packaging solution used for adding a protective layer of electronic connections and integrated circuits (ICs). It is used for devices, such as microphones, pressure sensors, accelerometers, gyroscopes, capacitors, resistors and transistors. Some of the commonly used WLP integration types include fan-out (FO), fan-in (FI), flip-chip, 3D FOWLP. These solutions are used at the wafer-level of the device, instead of dicing the wafer into the individual die and packaging them. This offers various benefits, such as a reduction in the size of the wafer chips, streamlining of the manufacturing processes and improvements in chip functionalities. The ultrathin wafers also provide improved heat dissipation and performance, form factor reduction and minimal power consumption.
Significant growth in the electronics industry across the globe represents one of the key factors creating a positive outlook on the market growth. Furthermore, the increasing requirement for more compact and faster consumer electronics is also driving the market growth. This has also enhanced the overall demand for cost-effective and high-performance packaging solutions for enhanced mechanical protection, structural support and extended battery life of the devices. Additionally, various technological advancements, such as the integration of connected devices with the Internet of Things (IoT), are acting as other growth-inducing factors. For instance, WLP is widely used for the manufacturing of radar systems in self-driving automobiles. It is also used in the healthcare sector for the production of various wearable devices. Other factors, including increasing circuit miniaturization in microelectronic devices, along with extensive research and development (R&D) activities, are anticipated to drive the market further.
Key Market Segmentation:
IMARC Group provides an analysis of the key trends in each sub-segment of the global wafer level packaging market report, along with forecasts at the global, regional and country level from 2024-2032. Our report has categorized the market based on packaging technology and end use industry.
Breakup by Packaging Technology:
- 3D TSV WLP
- 2.5D TSV WLP
- WLCSP
- Nano WLP
- Others
Breakup by End Use Industry:
- Aerospace and Defense
- Consumer Electronics
- IT & Telecommunication
- Healthcare
- Automotive
- Others
Breakup by Region:
- North America
- United States
- Canada
- Asia-Pacific
- China
- Japan
- India
- South Korea
- Australia
- Indonesia
- Others
- Europe
- Germany
- France
- United Kingdom
- Italy
- Spain
- Russia
- Others
- Latin America
- Brazil
- Mexico
- Others
- Middle East and Africa
Competitive Landscape:
The competitive landscape of the industry has also been examined along with the profiles of the key players being Amkor Technology Inc., China Wafer Level CSP Co. Ltd., Chipbond Technology Corporation, Deca Technologies Inc. (Infineon Technologies AG), Fujitsu Limited, IQE PLC, JCET Group Co. Ltd., Siliconware Precision Industries Co. Ltd. (Advanced Semiconductor Engineering Inc.), Tokyo Electron Ltd. and Toshiba Corporation.
Report Coverage:
| Report Features | Details |
|---|---|
| Base Year of the Analysis | 2023 |
| Historical Period | 2018-2023 |
| Forecast Period | 2024-2032 |
| Units | US$ Billion |
| Segment Coverage | Packaging Technology, End Use Industry, Region |
| Region Covered | Asia Pacific, Europe, North America, Latin America, Middle East and Africa |
| Countries Covered | United States, Canada, Germany, France, United Kingdom, Italy, Spain, Russia, China, Japan, India, South Korea, Australia, Indonesia, Brazil, Mexico |
| Companies Covered | Amkor Technology Inc., China Wafer Level CSP Co. Ltd., Chipbond Technology Corporation, Deca Technologies Inc. (Infineon Technologies AG), Fujitsu Limited, IQE PLC, JCET Group Co. Ltd., Siliconware Precision Industries Co. Ltd. (Advanced Semiconductor Engineering Inc.), Tokyo Electron Ltd. Toshiba Corporation |
| Customization Scope | 10% Free Customization |
| Report Price and Purchase Option | Single User License: US$ 3899 Five User License: US$ 4899 Corporate License: US$ 5899 |
| Post-Sale Analyst Support | 10-12 Weeks |
| Delivery Format | PDF and Excel through Email (We can also provide the editable version of the report in PPT/Word format on special request) |
The global wafer level packaging market was valued at US$ 5.7 Billion in 2023.
We expect the global wafer level packaging market to exhibit a CAGR of 16.1% during 2024-2032.
The rising demand for wafer level packaging as a cost-effective and high-performance packaging solutions for enhanced mechanical protection, structural support, and extended battery life of the consumer electronics devices, is primarily driving the global wafer level packaging market.
The sudden outbreak of the COVID-19 pandemic had led to the implementation of stringent lockdown regulations across several nations, resulting in the temporary closure of numerous end-use industries for wafer level packaging.
Based on the packaging technology, the global wafer level packaging market has been segmented into 3D TSV WLP, 2.5D TSV WLP, WLCSP, nano WLP, and others. Among these, 2.5D TSV WLP currently holds the majority of the total market share.
Based on the end use industry, the global wafer level packaging market can be divided into aerospace and defense, consumer electronics, IT & telecommunication, healthcare, automotive, and others. Currently, consumer electronics exhibit a clear dominance in the market.
On a regional level, the market has been classified into North America, Asia-Pacific, Europe, Latin America, and Middle East and Africa, where Asia-Pacific currently dominates the global market.
Some of the major players in the global wafer level packaging market include Amkor Technology Inc., China Wafer Level CSP Co. Ltd., Chipbond Technology Corporation, Deca Technologies Inc. (Infineon Technologies AG), Fujitsu Limited, IQE PLC, JCET Group Co. Ltd., Siliconware Precision Industries Co. Ltd. (Advanced Semiconductor Engineering Inc.), Tokyo Electron Ltd., and Toshiba Corporation.
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