The global high-density interconnect (HDI) PCBmarket size reached US$ 8.2 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 11.5 Billion by 2028, exhibiting a growth rate (CAGR) of 5.5% during 2023-2028.
Interconnecting printed circuit boards (PCBs) with high-density interconnects (HDIs) are circuit boards having a better wiring density per unit than conventional circuit boards. With blind and buried vias, it contains micro-vias that are smaller in diameter and have a relatively greater pad density than conventional circuit boards while having a higher circuitry density than traditional counterparts. High-density PCB technology has allowed engineers an enhanced design freedom and flexibility, thus allowing them to place smaller and closer components, which reduces signal loss and crossing delays. An interconnect PCB with high density gives designers more surface area to work with. As a result, high-density interconnect PCBs deliver better signal quality and faster signal transmission.
The global market is primarily driven by the escalating product demand in numerous end-use industries, including telecommunication, consumer electronics, and automotive. This can be attributed to the rapid product utilization in various electronic devices like touch-screen devices, mobile phones, laptop computers, and digital cameras. In addition to this, the rising trend of electronic device miniaturization and the increasing demand for high-performance gadgets are also providing an impetus to the market. Besides this, the expanding medical expenditure resulting in a higher uptake of medical devices and equipment is also creating a positive outlook for the market. Furthermore, the augmenting production rates of electronic aircraft parts and components are acting as a significant growth-inducing factor for the market. Some of the other factors contributing to the market growth include the widespread adoption of sophisticated safety systems, the rising trend of autonomous driving, escalating sales of smart devices and gaming consoles, inflating disposable income levels and extensive research and development (R&D) activities.
Key Market Segmentation:
IMARC Group provides an analysis of the key trends in each sub-segment of the global high-density interconnect (HDI) PCBmarket report, along with forecasts at the global, regional and country level from 2023-2028. Our report has categorized the market based on number of HDI layer and end use industry.
Breakup by Number of HDI Layer:
4-6 Layers HDI PCBs
8-10 Layer HDI PCBs
10+ Layer HDI PCBs
Breakup by End Use Industry:
Smartphones and Tablets
Breakup by Region:
Middle East and Africa
The competitive landscape of the industry has also been examined along with the profiles of the key players being AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Bittele Electronics Inc., Fineline Ltd., Meiko Electronics Co. Ltd., Millennium Circuits Limited, Mistral Solutions Pvt. Ltd., Shenzhen Kinwong Electronic Co. Ltd., Sierra Circuits, TTM Technologies Inc., Unimicron Technology Corporation (United Microelectronics Corporation), Unitech Printed Circuit Board Corp. and Würth Elektronik GmbH & Co. KG.
Base Year of the Analysis
Number of HDI Layer, End Use Industry, Region
Asia Pacific, Europe, North America, Latin America, Middle East and Africa
United States, Canada, Germany, France, United Kingdom, Italy, Spain, Russia, China, Japan, India, South Korea, Australia, Indonesia, Brazil, Mexico
AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Bittele Electronics Inc., Fineline Ltd., Meiko Electronics Co. Ltd., Millennium Circuits Limited, Mistral Solutions Pvt. Ltd., Shenzhen Kinwong Electronic Co. Ltd., Sierra Circuits, TTM Technologies Inc., Unimicron Technology Corporation (United Microelectronics Corporation), Unitech Printed Circuit Board Corp. and Würth Elektronik GmbH & Co. KG
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Key Questions Answered in This Report
The global High-Density Interconnect (HDI) PCB market was valued at US$ 8.2 Billion in 2022.
We expect the global High-Density Interconnect (HDI) PCB market to exhibit a CAGR of 5.5% during 2023-2028.
The emerging trend of electronic device miniaturization, along with the growing demand for High-Density Interconnect (HDI) PCB to deliver faster signal transmission, is primarily driving the global High-Density Interconnect (HDI) PCB market.
The sudden outbreak of the COVID-19 pandemic had led to the implementation of stringent lockdown regulations across several nations, resulting in the temporary closure of numerous manufacturing units for High-Density Interconnect (HDI) PCB.
Based on the number of HDI layer, the global High-Density Interconnect (HDI) PCB market has been segregated into 4-6 layers HDI PCBs, 8-10 layer HDI PCBs, and 10+ layer HDI PCBs. Currently, 4-6 layers HDI PCBs hold the majority of the total market share.
Based on the end use industry, the global High-Density Interconnect (HDI) PCB market can be bifurcated into smartphones and tablets, computers, telecom/datacom, consumer electronics, automotive, and others. Among these, the consumer electronics industry exhibits a clear dominance in the market.
On a regional level, the market has been classified into North America, Asia-Pacific, Europe, Latin America, and Middle East and Africa, where Asia-Pacific currently dominates the global market.
Some of the major players in the global High-Density Interconnect (HDI) PCB market include AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Bittele Electronics Inc., Fineline Ltd., Meiko Electronics Co. Ltd., Millennium Circuits Limited, Mistral Solutions Pvt. Ltd., Shenzhen Kinwong Electronic Co. Ltd., Sierra Circuits, TTM Technologies Inc., Unimicron Technology Corporation (United Microelectronics Corporation), Unitech Printed Circuit Board Corp., and Würth Elektronik GmbH & Co. KG.
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