The global high-density interconnect (HDI) PCBmarket size reached US$ 8.2 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 11.5 Billion by 2028, exhibiting a growth rate (CAGR) of 5.5% during 2023-2028.
Interconnecting printed circuit boards (PCBs) with high-density interconnects (HDIs) are circuit boards having a better wiring density per unit than conventional circuit boards. With blind and buried vias, it contains micro-vias that are smaller in diameter and have a relatively greater pad density than conventional circuit boards while having a higher circuitry density than traditional counterparts. High-density PCB technology has allowed engineers an enhanced design freedom and flexibility, thus allowing them to place smaller and closer components, which reduces signal loss and crossing delays. An interconnect PCB with high density gives designers more surface area to work with. As a result, high-density interconnect PCBs deliver better signal quality and faster signal transmission.
The global market is primarily driven by the escalating product demand in numerous end-use industries, including telecommunication, consumer electronics, and automotive. This can be attributed to the rapid product utilization in various electronic devices like touch-screen devices, mobile phones, laptop computers, and digital cameras. In addition to this, the rising trend of electronic device miniaturization and the increasing demand for high-performance gadgets are also providing an impetus to the market. Besides this, the expanding medical expenditure resulting in a higher uptake of medical devices and equipment is also creating a positive outlook for the market. Furthermore, the augmenting production rates of electronic aircraft parts and components are acting as a significant growth-inducing factor for the market. Some of the other factors contributing to the market growth include the widespread adoption of sophisticated safety systems, the rising trend of autonomous driving, escalating sales of smart devices and gaming consoles, inflating disposable income levels and extensive research and development (R&D) activities.
Key Market Segmentation:
IMARC Group provides an analysis of the key trends in each sub-segment of the global high-density interconnect (HDI) PCBmarket report, along with forecasts at the global, regional and country level from 2023-2028. Our report has categorized the market based on number of HDI layer and end use industry.
Breakup by Number of HDI Layer:
4-6 Layers HDI PCBs
8-10 Layer HDI PCBs
10+ Layer HDI PCBs
Breakup by End Use Industry:
Smartphones and Tablets
Computers
Telecom/Datacom
Consumer Electronics
Automotive
Others
Breakup by Region:
North America
United States
Canada
Asia-Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
Competitive Landscape:
The competitive landscape of the industry has also been examined along with the profiles of the key players being AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Bittele Electronics Inc., Fineline Ltd., Meiko Electronics Co. Ltd., Millennium Circuits Limited, Mistral Solutions Pvt. Ltd., Shenzhen Kinwong Electronic Co. Ltd., Sierra Circuits, TTM Technologies Inc., Unimicron Technology Corporation (United Microelectronics Corporation), Unitech Printed Circuit Board Corp. and Würth Elektronik GmbH & Co. KG.
Report Coverage:
Report Features
Details
Base Year of the Analysis
2022
Historical Period
2017-2022
Forecast Period
2023-2028
Units
US$ Billion
Segment Coverage
Number of HDI Layer, End Use Industry, Region
Region Covered
Asia Pacific, Europe, North America, Latin America, Middle East and Africa
Countries Covered
United States, Canada, Germany, France, United Kingdom, Italy, Spain, Russia, China, Japan, India, South Korea, Australia, Indonesia, Brazil, Mexico
Companies Covered
AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Bittele Electronics Inc., Fineline Ltd., Meiko Electronics Co. Ltd., Millennium Circuits Limited, Mistral Solutions Pvt. Ltd., Shenzhen Kinwong Electronic Co. Ltd., Sierra Circuits, TTM Technologies Inc., Unimicron Technology Corporation (United Microelectronics Corporation), Unitech Printed Circuit Board Corp. and Würth Elektronik GmbH & Co. KG
Customization Scope
10% Free Customization
Report Price and Purchase Option
Single User License: US$ 2499
Five User License: US$ 3499
Corporate License: US$ 4499
Post-Sale Analyst Support
10-12 Weeks
Delivery Format
PDF and Excel through Email (We can also provide the editable version of the report in PPT/Word format on special request)
Key Questions Answered in This Report
The global High-Density Interconnect (HDI) PCB market was valued at US$ 8.2 Billion in 2022.
We expect the global High-Density Interconnect (HDI) PCB market to exhibit a CAGR of 5.5% during 2023-2028.
The emerging trend of electronic device miniaturization, along with the growing demand for High-Density Interconnect (HDI) PCB to deliver faster signal transmission, is primarily driving the global High-Density Interconnect (HDI) PCB market.
The sudden outbreak of the COVID-19 pandemic had led to the implementation of stringent lockdown regulations across several nations, resulting in the temporary closure of numerous manufacturing units for High-Density Interconnect (HDI) PCB.
Based on the number of HDI layer, the global High-Density Interconnect (HDI) PCB market has been segregated into 4-6 layers HDI PCBs, 8-10 layer HDI PCBs, and 10+ layer HDI PCBs. Currently, 4-6 layers HDI PCBs hold the majority of the total market share.
Based on the end use industry, the global High-Density Interconnect (HDI) PCB market can be bifurcated into smartphones and tablets, computers, telecom/datacom, consumer electronics, automotive, and others. Among these, the consumer electronics industry exhibits a clear dominance in the market.
On a regional level, the market has been classified into North America, Asia-Pacific, Europe, Latin America, and Middle East and Africa, where Asia-Pacific currently dominates the global market.
Some of the major players in the global High-Density Interconnect (HDI) PCB market include AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Bittele Electronics Inc., Fineline Ltd., Meiko Electronics Co. Ltd., Millennium Circuits Limited, Mistral Solutions Pvt. Ltd., Shenzhen Kinwong Electronic Co. Ltd., Sierra Circuits, TTM Technologies Inc., Unimicron Technology Corporation (United Microelectronics Corporation), Unitech Printed Circuit Board Corp., and Würth Elektronik GmbH & Co. KG.
Need more help?
Speak to our experienced analysts for insights on the current market scenarios.
Include additional segments and countries to customize the report as per your requirement.
Gain an unparalleled competitive advantage in your domain by understanding how to utilize the report and positively impacting your operations and revenue.
For further assistance, please connect with our analysts.
Gain a deeper dive into a specific application, geography, customer, or competitor
Any level of personalization
Get in Touch With Us
UNITED STATES
Phone: +1-631-791-1145
INDIA
Phone: +91-120-433-0800
UNITED KINGDOM
Phone: +44-753-713-2163
Email: sales@imarcgroup.com
Client Testimonials
IMARC made the whole process easy. Everyone I spoke with via email was polite, easy to deal with, kept their promises regarding delivery timelines and were solutions focused. From my first contact, I was grateful for the professionalism shown by the whole IMARC team. I recommend IMARC to all that need timely, affordable information and advice. My experience with IMARC was excellent and I can not fault it.
The IMARC team was very reactive and flexible with regard to our requests. A very good overall experience. We are happy with the work that IMARC has provided, very complete and detailed. It has contributed to our business needs and provided the market visibility that we required
We were very happy with the collaboration between IMARC and Colruyt. Not only were your prices competitive, IMARC was also pretty fast in understanding the scope and our needs for this project. Even though it was not an easy task, performing a market research during the COVID-19 pandemic, you were able to get us the necessary information we needed. The IMARC team was very easy to work with and they showed us that it would go the extra mile if we needed anything extra
We would be happy to reach out to IMARC again, if we need Market Research/Consulting/Consumer Research or any associated service. Overall experience was good, and the data points were quite helpful.
The figures of market study were very close to our assumed figures. The presentation of the study was neat and easy to analyse. The requested details of the study were fulfilled. My overall experience with the IMARC Team was satisfactory.
The overall cost of the services were within our expectations. I was happy to have good communications in a timely manner. It was a great and quick way to have the information I needed.
My questions and concerns were answered in a satisfied way. The costs of the services were within our expectations. My overall experience with the IMARC Team was very good.
I agree the report was timely delivered, meeting the key objectives of the engagement. We had some discussion on the contents, adjustments were made fast and accurate. The response time was minimum in each case. Very good. You have a satisfied customer.
We would be happy to reach out to IMARC for more market reports in the future. The response from the account sales manager was very good. I appreciate the timely follow ups and post purchase support from the team. My overall experience with IMARC was good.
IMARC was a good solution for the data points that we really needed and couldn't find elsewhere. The team was easy to work, quick to respond, and flexible to our customization requests.
This site uses cookies (including third-party cookies) to record user’s preferences which help us to enhance our services. For further information review our Privacy Policy.
This site uses cookies to improve user experience.Privacy Policy.