High-Density Interconnect (HDI) PCB Market Report by Number of HDI Layer (4-6 Layers HDI PCBs, 8-10 Layer HDI PCBs, 10+ Layer HDI PCBs), End Use Industry (Smartphones and Tablets, Computers, Telecom/Datacom, Consumer Electronics, Automotive, and Others), and Region 2024-2032

High-Density Interconnect (HDI) PCB Market Report by Number of HDI Layer (4-6 Layers HDI PCBs, 8-10 Layer HDI PCBs, 10+ Layer HDI PCBs), End Use Industry (Smartphones and Tablets, Computers, Telecom/Datacom, Consumer Electronics, Automotive, and Others), and Region 2024-2032

Report Format: PDF+Excel | Report ID: SR112024A6302
Buy Now

Market Overview:

The global high-density interconnect (HDI) PCB market size reached US$ 8.7 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 13.4 Billion by 2032, exhibiting a growth rate (CAGR) of 4.8% during 2024-2032.

Report Attribute 
Key Statistics
Base Year
2023
Forecast Years
2024-2032
Historical Years
2018-2023
Market Size in 2023
US$ 8.7 Billion
Market Forecast in 2032
US$ 13.4 Billion
Market Growth Rate (2024-2032) 4.8%


Interconnecting printed circuit boards (PCBs) with high-density interconnects (HDIs) are circuit boards having a better wiring density per unit than conventional circuit boards. With blind and buried vias, it contains micro-vias that are smaller in diameter and have a relatively greater pad density than conventional circuit boards while having a higher circuitry density than traditional counterparts. High-density PCB technology has allowed engineers an enhanced design freedom and flexibility, thus allowing them to place smaller and closer components, which reduces signal loss and crossing delays. An interconnect PCB with high density gives designers more surface area to work with. As a result, high-density interconnect PCBs deliver better signal quality and faster signal transmission.

Global High-Density Interconnect (HDI) PCB Market

High-Density Interconnect (HDI) PCB Market Trends:

The global market is primarily driven by the escalating product demand in numerous end-use industries, including telecommunication, consumer electronics, and automotive. This can be attributed to the rapid product utilization in various electronic devices like touch-screen devices, mobile phones, laptop computers, and digital cameras. In addition to this, the rising trend of electronic device miniaturization and the increasing demand for high-performance gadgets are also providing an impetus to the market. Besides this, the expanding medical expenditure resulting in a higher uptake of medical devices and equipment is also creating a positive outlook for the market. Furthermore, the augmenting production rates of electronic aircraft parts and components are acting as a significant growth-inducing factor for the market. Some of the other factors contributing to the market growth include the widespread adoption of sophisticated safety systems, the rising trend of autonomous driving, escalating sales of smart devices and gaming consoles, inflating disposable income levels and extensive research and development (R&D) activities.

Key Market Segmentation:

IMARC Group provides an analysis of the key trends in each sub-segment of the global high-density interconnect (HDI) PCB market report, along with forecasts at the global, regional and country levels from 2024-2032. Our report has categorized the market based on number of HDI layer and end use industry.

Breakup by Number of HDI Layer:

  • 4-6 Layers HDI PCBs
  • 8-10 Layer HDI PCBs
  • 10+ Layer HDI PCBs
     

Breakup by End Use Industry:

  • Smartphones and Tablets
  • Computers
  • Telecom/Datacom
  • Consumer Electronics
  • Automotive
  • Others
     

Breakup by Region:

  • North America
    • United States
    • Canada
  • Asia-Pacific
    • China
    • Japan
    • India
    • South Korea
    • Australia
    • Indonesia
    • Others
  • Europe
    • Germany
    • France
    • United Kingdom
    • Italy
    • Spain
    • Russia
    • Others
  • Latin America
    • Brazil
    • Mexico
    • Others
  • Middle East and Africa
     

Competitive Landscape:

The competitive landscape of the industry has also been examined along with the profiles of the key players being AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Bittele Electronics Inc., Fineline Ltd., Meiko Electronics Co. Ltd., Millennium Circuits Limited, Mistral Solutions Pvt. Ltd., Shenzhen Kinwong Electronic Co. Ltd., Sierra Circuits, TTM Technologies Inc., Unimicron Technology Corporation (United Microelectronics Corporation), Unitech Printed Circuit Board Corp. and Würth Elektronik GmbH & Co. KG.

Report Coverage:

Report Features Details
Base Year of the Analysis 2023
Historical Period 2018-2023
Forecast Period 2024-2032
Units US$ Billion
Segment Coverage Number of HDI Layer, End Use Industry, Region
Region Covered Asia Pacific, Europe, North America, Latin America, Middle East and Africa
Countries Covered United States, Canada, Germany, France, United Kingdom, Italy, Spain, Russia, China, Japan, India, South Korea, Australia, Indonesia, Brazil, Mexico
Companies Covered AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Bittele Electronics Inc., Fineline Ltd., Meiko Electronics Co. Ltd., Millennium Circuits Limited, Mistral Solutions Pvt. Ltd., Shenzhen Kinwong Electronic Co. Ltd., Sierra Circuits, TTM Technologies Inc., Unimicron Technology Corporation (United Microelectronics Corporation), Unitech Printed Circuit Board Corp. and Würth Elektronik GmbH & Co. KG
Customization Scope 10% Free Customization
Report Price and Purchase Option Single User License: US$ 3899
Five User License: US$ 4899
Corporate License: US$ 5899
Post-Sale Analyst Support 10-12 Weeks
Delivery Format PDF and Excel through Email (We can also provide the editable version of the report in PPT/Word format on special request)

Key Questions Answered in This Report

The global High-Density Interconnect (HDI) PCB market was valued at US$ 8.7 Billion in 2023.

We expect the global High-Density Interconnect (HDI) PCB market to exhibit a CAGR of 4.8% during 2024-2032.

The emerging trend of electronic device miniaturization, along with the growing demand for High-Density Interconnect (HDI) PCB to deliver faster signal transmission, is primarily driving the global High-Density Interconnect (HDI) PCB market.

The sudden outbreak of the COVID-19 pandemic had led to the implementation of stringent lockdown regulations across several nations, resulting in the temporary closure of numerous manufacturing units for High-Density Interconnect (HDI) PCB.

Based on the number of HDI layer, the global High-Density Interconnect (HDI) PCB market has been segregated into 4-6 layers HDI PCBs, 8-10 layer HDI PCBs, and 10+ layer HDI PCBs. Currently, 4-6 layers HDI PCBs hold the majority of the total market share.

Based on the end use industry, the global High-Density Interconnect (HDI) PCB market can be bifurcated into smartphones and tablets, computers, telecom/datacom, consumer electronics, automotive, and others. Among these, the consumer electronics industry exhibits a clear dominance in the market.

On a regional level, the market has been classified into North America, Asia-Pacific, Europe, Latin America, and Middle East and Africa, where Asia-Pacific currently dominates the global market.

Some of the major players in the global High-Density Interconnect (HDI) PCB market include AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Bittele Electronics Inc., Fineline Ltd., Meiko Electronics Co. Ltd., Millennium Circuits Limited, Mistral Solutions Pvt. Ltd., Shenzhen Kinwong Electronic Co. Ltd., Sierra Circuits, TTM Technologies Inc., Unimicron Technology Corporation (United Microelectronics Corporation), Unitech Printed Circuit Board Corp., and Würth Elektronik GmbH & Co. KG.

Need more help?

  • Speak to our experienced analysts for insights on the current market scenarios.
  • Include additional segments and countries to customize the report as per your requirement.
  • Gain an unparalleled competitive advantage in your domain by understanding how to utilize the report and positively impacting your operations and revenue.
  • For further assistance, please connect with our analysts.
High-Density Interconnect (HDI) PCB Market Report by Number of HDI Layer (4-6 Layers HDI PCBs, 8-10 Layer HDI PCBs, 10+ Layer HDI PCBs), End Use Industry (Smartphones and Tablets, Computers, Telecom/Datacom, Consumer Electronics, Automotive, and Others), and Region 2024-2032
Purchase options




Benefits of Customization

Personalize this research

Triangulate with your data

Get data as per your format and definition

Gain a deeper dive into a specific application, geography, customer, or competitor

Any level of personalization

Get in Touch With Us
UNITED STATES

Phone: +1-631-791-1145

INDIA

Phone: +91-120-433-0800

UNITED KINGDOM

Phone: +44-753-713-2163

Email: sales@imarcgroup.com

Client Testimonials

Aktive Services

IMARC made the whole process easy. Everyone I spoke with via email was polite, easy to deal with, kept their promises regarding delivery timelines and were solutions focused. From my first contact, I was grateful for the professionalism shown by the whole IMARC team. I recommend IMARC to all that need timely, affordable information and advice. My experience with IMARC was excellent and I can not fault it.

Read More
Greenfish S.A.

The IMARC team was very reactive and flexible with regard to our requests. A very good overall experience. We are happy with the work that IMARC has provided, very complete and detailed. It has contributed to our business needs and provided the market visibility that we required

Read More
Colruyt Group

We were very happy with the collaboration between IMARC and Colruyt. Not only were your prices competitive, IMARC was also pretty fast in understanding the scope and our needs for this project. Even though it was not an easy task, performing a market research during the COVID-19 pandemic, you were able to get us the necessary information we needed. The IMARC team was very easy to work with and they showed us that it would go the extra mile if we needed anything extra

Read More
KRISHAK BHARTI CO-OP LTD

Last project executed by your team was as per our expectations. We also would like to associate for more assignments this year. Kudos to your team.

Read More
Zee Media Corp. Ltd.

We would be happy to reach out to IMARC again, if we need Market Research/Consulting/Consumer Research or any associated service. Overall experience was good, and the data points were quite helpful.

Read More
Arabian Plastic Manufacturing Company Ltd.

The figures of market study were very close to our assumed figures. The presentation of the study was neat and easy to analyse. The requested details of the study were fulfilled. My overall experience with the IMARC Team was satisfactory.

Read More
Sumitomo Corporation

The overall cost of the services were within our expectations. I was happy to have good communications in a timely manner. It was a great and quick way to have the information I needed.

Read More
Hameln Rds

My questions and concerns were answered in a satisfied way. The costs of the services were within our expectations. My overall experience with the IMARC Team was very good.

Read More
Quality Consultants BV

I agree the report was timely delivered, meeting the key objectives of the engagement. We had some discussion on the contents, adjustments were made fast and accurate. The response time was minimum in each case. Very good. You have a satisfied customer.

Read More
TATA Advanced Systems Limited

We would be happy to reach out to IMARC for more market reports in the future. The response from the account sales manager was very good. I appreciate the timely follow ups and post purchase support from the team. My overall experience with IMARC was good.

Read More
Stax

IMARC was a good solution for the data points that we really needed and couldn't find elsewhere. The team was easy to work, quick to respond, and flexible to our customization requests.

Read More