The India semiconductor packaging market size reached USD 1.43 Billion in 2024. Looking forward, IMARC Group expects the market to reach USD 2.81 Billion by 2033, exhibiting a growth rate (CAGR) of 7.22% during 2025-2033. The market is expanding rapidly, driven by government initiatives like the India Semiconductor Mission (ISM) and Production Linked Incentive (PLI) scheme. Additionally, investments from global players, advancements in 2.5D, 3D ICs, and System-in-Package (SiP) technologies, and the rising demand in consumer electronics and automotive sectors are strengthening domestic packaging capabilities and supply chains.
Report Attribute
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Key Statistics
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Base Year
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2024 |
Forecast Years
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2025-2033
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Historical Years
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2019-2024
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Market Size in 2024 | USD 1.43 Billion |
Market Forecast in 2033 | USD 2.81 Billion |
Market Growth Rate 2025-2033 | 7.22% |
Government Support and Local Manufacturing Expansion
India's semiconductor packaging market is experiencing rapid growth due to strong government support and increasing local manufacturing efforts. The India Semiconductor Mission (ISM) is attracting global players with financial incentives and policy support, fostering domestic chip packaging and assembly capabilities. The Production Linked Incentive (PLI) scheme further encourages investment in semiconductor manufacturing, strengthening India’s position in the global supply chain. For instance, in September 2024, NXP Semiconductors announced plans to invest USD 1 Billion in India to expand research and development (R&D). This investment strengthens India's semiconductor packaging capabilities, enhancing its role in the global supply chain. These initiatives align with India's goal of becoming a semiconductor hub, ensuring a stable supply chain for consumer electronics and automotive industries. The push for localization is also driving collaborations between global semiconductor firms and Indian technology companies to develop high-quality packaging solutions.
Advancements in Packaging Technologies
The Indian semiconductor packaging industry is shifting towards advanced packaging technologies such as 2.5D, 3D ICs, and System-in-Package (SiP) solutions. For instance, in August 2024, Kaynes SemiCon announced an MoU with Lightspeed Photonics, securing India’s first paying OSAT customer. The partnership enables Kaynes to provide advanced packaging for Lightspeed’s LightSiP technology, enhancing semiconductor manufacturing and supporting high-volume production in India’s growing semiconductor ecosystem. These technologies enhance chip performance, power efficiency, and miniaturization, catering to the growing demand for high-performance computing, artificial intelligence, and IoT applications. With increasing adoption of 5G, electric vehicles, and smart devices, semiconductor firms in India are investing in research and development to improve packaging capabilities. Furthermore, this trend is crucial for India's semiconductor ecosystem, helping local manufacturers meet international quality standards while addressing the increasing complexity of modern semiconductor applications.
IMARC Group provides an analysis of the key trends in each segment of the market, along with forecasts at the region level for 2025-2033. Our report has categorized the market based on type, packaging material, technology, and end user.
Type Insights:
The report has provided a detailed breakup and analysis of the market based on the type. This includes flip chip, embedded DIE, fan-in WLP, and fan-out WLP.
Packaging Material Insights:
A detailed breakup and analysis of the market based on the packaging material have also been provided in the report. This includes organic substrate, bonding wire, leadframe, ceramic package, die attach material, and others.
Technology Insights:
The report has provided a detailed breakup and analysis of the market based on the technology. This includes grid array, small outline package, flat no-leads package, dual in-line package, and others.
End User Insights:
A detailed breakup and analysis of the market based on the end user have also been provided in the report. This includes consumer electronics, automotive, healthcare, IT and telecommunication, aerospace and defense, and others.
Regional Insights:
The report has also provided a comprehensive analysis of all the major regional markets, which include North India, South India, East India, and West India.
The market research report has also provided a comprehensive analysis of the competitive landscape. Competitive analysis such as market structure, key player positioning, top winning strategies, competitive dashboard, and company evaluation quadrant has been covered in the report. Also, detailed profiles of all major companies have been provided.
Report Features | Details |
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Base Year of the Analysis | 2024 |
Historical Period | 2019-2024 |
Forecast Period | 2025-2033 |
Units | Billion USD |
Scope of the Report | Exploration of Historical Trends and Market Outlook, Industry Catalysts and Challenges, Segment-Wise Historical and Future Market Assessment:
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Types Covered | Flip Chip, Embedded DIE, Fan-In WLP, Fan-Out WLP |
Packaging Materials Covered | Organic Substrate, Bonding Wire, Leadframe, Ceramic Package, Die Attach Material, Others |
Technologies Covered | Grid Array, Small Outline Package, Flat No-Leads Package, Dual In-Line Package, Others |
End Users Covered | Consumer Electronics, Automotive, Healthcare, IT and Telecommunication, Aerospace and Defense, Others |
Regions Covered | North India, South India, East India, West India |
Customization Scope | 10% Free Customization |
Post-Sale Analyst Support | 10-12 Weeks |
Delivery Format | PDF and Excel through Email (We can also provide the editable version of the report in PPT/Word format on special request) |
Key Questions Answered in This Report:
Key Benefits for Stakeholders: