The Japan printed circuit board market size reached USD 4.31 Billion in 2024. Looking forward, the market is expected to reach USD 6.05 Billion by 2033, exhibiting a growth rate (CAGR) of 3.45% during 2025-2033. Demand is shaped by automotive electronics, 5G and data-center buildouts, and renewed domestic semiconductor investment, strengthening the Japan printed circuit board market share.
Report Attribute
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Key Statistics
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Base Year
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2024
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Forecast Years
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2025-2033
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Historical Years
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2019-2024
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Market Size in 2024 | USD 4.31 Billion |
Market Forecast in 2033 | USD 6.05 Billion |
Market Growth Rate 2025-2033 | 3.45% |
Rise of Advanced Flexible and High-Density PCBs
The Japan Printed Circuit Board market is experiencing strong momentum in flexible and HDI board adoption, fueled by miniaturization and demand for compact electronics. Official data show that in July 2024, Japan’s total PCB output rose 3.7% year-on-year to ¥51.6 billion, marking the first rebound in nearly two years. Notably, flexible PCB production surged 13.8% to ¥2.7 billion, with volumes expanding 12.3% to 136,000 m². This sharp growth highlights the importance of flexible and rigid-flex designs in consumer wearables, IoT applications, and lightweight automotive modules. At the same time, HDI technologies supporting finer interconnects are critical for high-performance devices, directly contributing to Japan printed circuit board market growth.
Innovation and Sustainability in PCB Manufacturing
Japanese PCB producers are also prioritizing eco-friendly and high-tech manufacturing, blending innovation with sustainability. On the global stage, the flexible PCB market was valued at USD 12.85 Billion in 2024 and is forecast to almost double to USD 24.65 Billion by 2030, at a CAGR of 11.5%. This expansion aligns with Japan’s strategy of developing advanced substrates, lightweight boards, and IoT-enabled manufacturing systems to serve medical devices, automotive electronics, and consumer gadgets. Domestic firms are investing in next-generation materials and automation to cut energy use and improve reliability, ensuring compliance with tightening environmental regulations. These initiatives are instrumental in maintaining competitiveness and fueling Japan printed circuit board market growth.
IMARC Group provides an analysis of the key trends in each segment of the market, along with forecasts at the country and regional levels for 2025-2033. Our report has categorized the market based on type, substrate, and end use industry.
Type Insights:
The report has provided a detailed breakup and analysis of the market based on the type. This includes single-sided, double-sided, multi-layer, and HDI.
Substrate Insights:
A detailed breakup and analysis of the market based on the substrate have also been provided in the report. This includes rigid, flexible, and rigid-flex.
End Use Industry Insights:
A detailed breakup and analysis of the market based on the end use industry have also been provided in the report. This includes industrial electronics, healthcare, aerospace and defense, automotive, IT and telecom, consumer electronics, and others.
Regional Insights:
The report has also provided a comprehensive analysis of all the major regional markets, which include Kanto Region, Kansai/Kinki Region, Central/Chubu Region, Kyushu-Okinawa Region, Tohoku Region, Chugoku Region, Hokkaido Region, and Shikoku Region.
The market research report has also provided a comprehensive analysis of the competitive landscape. Competitive analysis such as market structure, key player positioning, top winning strategies, competitive dashboard, and company evaluation quadrant has been covered in the report. Also, detailed profiles of all major companies have been provided.
Report Features | Details |
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Base Year of the Analysis | 2024 |
Historical Period | 2019-2024 |
Forecast Period | 2025-2033 |
Units | Billion USD |
Scope of the Report |
Exploration of Historical Trends and Market Outlook, Industry Catalysts and Challenges, Segment-Wise Historical and Future Market Assessment:
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Types Covered | Single-Sided, Double-Sided, Multi-Layer, HDI |
Substrates Covered | Rigid, Flexible, Rigid-Flex |
End Use Industries Covered | Industrial Electronics, Healthcare, Aerospace and Defense, Automotive, IT and Telecom, Consumer Electronics, Others |
Regions Covered | Kanto Region, Kansai/Kinki Region, Central/Chubu Region, Kyushu-Okinawa Region, Tohoku Region, Chugoku Region, Hokkaido Region, Shikoku Region |
Customization Scope | 10% Free Customization |
Post-Sale Analyst Support | 10-12 Weeks |
Delivery Format | PDF and Excel through Email (We can also provide the editable version of the report in PPT/Word format on special request) |
Key Questions Answered in This Report:
Key Benefits for Stakeholders: