Radiation-Hardened Electronics Market Report by Product Type (Custom Made, Commercial-Off-the-Shelf), Material Type (Silicon, Silicon Carbide, Gallium Nitride, and Others), Technique (Radiation Hardening by Design (RHBD), Radiation Hardening by Process (RHBP), Radiation Hardening by Software (RHBS)), Component Type (Power Management, Application Specific Integrated Circuit, Logic, Memory, Field-Programmable Gate Array, and Others), Application (Space Satellites, Commercial Satellites, Military, Aerospace and Defense, Nuclear Power Plants, and Others), and Region 2024-2032

Radiation-Hardened Electronics Market Report by Product Type (Custom Made, Commercial-Off-the-Shelf), Material Type (Silicon, Silicon Carbide, Gallium Nitride, and Others), Technique (Radiation Hardening by Design (RHBD), Radiation Hardening by Process (RHBP), Radiation Hardening by Software (RHBS)), Component Type (Power Management, Application Specific Integrated Circuit, Logic, Memory, Field-Programmable Gate Array, and Others), Application (Space Satellites, Commercial Satellites, Military, Aerospace and Defense, Nuclear Power Plants, and Others), and Region 2024-2032

Report Format: PDF+Excel | Report ID: SR112024A2172
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Market Overview:

The global radiation-hardened electronics market size reached US$ 1.4 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 1.7 Billion by 2032, exhibiting a growth rate (CAGR) of 2.5% during 2024-2032.

Report Attribute
 Key Statistics
Base Year
2023 
Forecast Years
2024-2032
Historical Years
2018-2023
Market Size in 2023 US$ 1.4 Billion
Market Forecast in 2032 US$ 1.7 Billion
Market Growth Rate 2024-2032 2.5%


Radiation-hardened electronics refer to various electronic components, packages and products that are primarily used for high-altitude applications. The materials used for the manufacturing of such components include silicon, silicon carbide, gallium nitride and hydrogenated amorphous silicon. These components are resistant to the damage caused by ionizing and high-energy radiations, and gamma and neutron radiation emitted by nuclear reactors. They are widely employed in satellites, aircraft and nuclear power plants in the form of switching regulators, microprocessors and power supply devices. Owing to this, they find extensive applications across various industries, including aviation, space, military and defense. 

 

 
 

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The global market is primarily being driven by the increasing number of space missions and exploratory activities. In line with this, the rising demand for communication satellites for intelligence, surveillance and reconnaissance (ISR) operations is also providing a boost to the market growth. Radiation-hardened electronics is crucial for protecting electronic equipment from physical damage and failure caused by harmful radiations in outer space. Furthermore, widespread product adoption for manufacturing power management devices is creating a positive impact on the market. These electronics are also used to manufacture diodes, transistors and metal-oxide-semiconductor field-effect transistors (MOSFET) for various defense and military applications. Additionally, various technological advancements, such as the development of highly reliable integrated circuits and improvements in the field-programmable gate array (FPGA) technology, are creating a positive outlook for the market. Other factors, including significant growth in the electronics industry and extensive research and development (R&D) activities, are projected to drive the market further. 

Key Market Segmentation:

IMARC Group provides an analysis of the key trends in each sub-segment of the global radiation-hardened electronics market report, along with forecasts at the global, regional and country level from 2024-2032. Our report has categorized the market based on product type, material type, technique, component type and application.

Breakup by Product Type:

 

 
 

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  • Custom Made
  • Commercial-Off-the-Shelf
     

Breakup by Material Type:

  • Silicon
  • Silicon Carbide
  • Gallium Nitride
  • Others
     

Breakup by Technique:

  • Radiation Hardening by Design (RHBD)
  • Radiation Hardening by Process (RHBP)
  • Radiation Hardening by Software (RHBS)
     

Breakup by Component Type:

  • Power Management
  • Application Specific Integrated Circuit
  • Logic
  • Memory
  • Field-Programmable Gate Array
  • Others
     

Breakup by Application:

  • Space Satellites
  • Commercial Satellites
  • Military
  • Aerospace and Defense
  • Nuclear Power Plants
  • Others
     

Breakup by Region:

 

 
 

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  • North America
    • United States
    • Canada
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • Australia
    • Indonesia
    • Others
  • Europe
    • Germany
    • France
    • United Kingdom
    • Italy
    • Spain
    • Russia
    • Others
  • Latin America
    • Brazil
    • Mexico
    • Others
  • Middle East and Africa
     

Competitive Landscape:

The report has also analysed the competitive landscape of the market with some of the key players being Analog Devices Inc., BAE Systems plc, Cobham Plc (Advent International), Data Device Corporation (Transdigm Group Incorporated), Honeywell International Inc., Microchip Technology Inc, STMicroelectronics, Texas Instruments Incorporated, The Boeing Company, Xilinx Inc., etc.

Report Coverage:

Report Features Details
Base Year of the Analysis 2023
Historical Period 2018-2023
Forecast Period 2024-2032
Units US$ Billion
Segment Coverage Product Type, Material Type, Technique, Component Type, Application, Region
Region Covered  Asia Pacific, Europe, North America, Latin America, Middle East and Africa
Countries Covered United States, Canada, Germany, France, United Kingdom, Italy, Spain, Russia, China, Japan, India, South Korea, Australia, Indonesia, Brazil, Mexico
Companies Covered Analog Devices Inc., BAE Systems plc, Cobham Plc (Advent International), Data Device Corporation (Transdigm Group Incorporated), Honeywell International Inc., Microchip Technology Inc, STMicroelectronics, Texas Instruments Incorporated, The Boeing Company and Xilinx Inc
Customization Scope 10% Free Customization
Report Price and Purchase Option Single User License: US$ 3899
Five User License: US$ 4899
Corporate License: US$ 5899
Post-Sale Analyst Support 10-12 Weeks
Delivery Format PDF and Excel through Email (We can also provide the editable version of the report in PPT/Word format on special request)

Key Questions Answered in This Report

The global radiation-hardened electronics market was valued at US$ 1.4 Billion in 2023.

We expect the global radiation-hardened electronics market to exhibit a CAGR of 2.5% during 2024-2032.

The widespread adoption of radiation-hardened electronics for protecting equipment from physical damage and failure caused by harmful radiations in outer space is primarily driving the global radiation-hardened electronics market.

The sudden outbreak of the COVID-19 pandemic had led to the implementation of stringent lockdown regulations across several nations, resulting in the temporary closure of numerous manufacturing units for radiation-hardened electronics.

Based on the product type, the global radiation-hardened electronics market can be segmented into custom made and commercial-off-the-shelf. Currently, custom made holds the majority of the total market share.

Based on the material type, the global radiation-hardened electronics market has been divided into silicon, silicon carbide, gallium nitride, and others. Among these, silicon and silicon carbide currently exhibits a clear dominance in the market.

Based on the technique, the global radiation-hardened electronics market can be categorized into Radiation Hardening by Design (RHBD), Radiation Hardening by Process (RHBP), and Radiation Hardening by Software (RHBS). Currently, Radiation Hardening by Design (RHBD) accounts for the majority of the global market share.

Based on the component type, the global radiation-hardened electronics market has been segregated into power management, application specific integrated circuit, logic, memory, field-programmable gate array, and others. Among these, power management currently holds the largest market share.

Based on the application, the global radiation-hardened electronics market can be bifurcated into space satellites, commercial satellites, military, aerospace and defense, nuclear power plants, and others. Currently, commercial satellites exhibit a clear dominance in the market.

On a regional level, the market has been classified into North America, Asia Pacific, Europe, Latin America, and Middle East and Africa, where North America currently dominates the global market.

Some of the major players in the global radiation-hardened electronics market include Analog Devices Inc., BAE Systems plc, Cobham Plc (Advent International), Data Device Corporation (Transdigm Group Incorporated), Honeywell International Inc., Microchip Technology Inc, STMicroelectronics, Texas Instruments Incorporated, The Boeing Company, Xilinx Inc., etc.

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Radiation-Hardened Electronics Market Report by Product Type (Custom Made, Commercial-Off-the-Shelf), Material Type (Silicon, Silicon Carbide, Gallium Nitride, and Others), Technique (Radiation Hardening by Design (RHBD), Radiation Hardening by Process (RHBP), Radiation Hardening by Software (RHBS)), Component Type (Power Management, Application Specific Integrated Circuit, Logic, Memory, Field-Programmable Gate Array, and Others), Application (Space Satellites, Commercial Satellites, Military, Aerospace and Defense, Nuclear Power Plants, and Others), and Region 2024-2032
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