Radiation-Hardened Electronics Market

Market Overview:

The global radiation-hardened electronics market size reached US$ 1.3 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 1.6 Billion by 2028, exhibiting a growth rate (CAGR) of 2.9% during 2023-2028.

Radiation-hardened electronics refer to various electronic components, packages and products that are primarily used for high-altitude applications. The materials used for the manufacturing of such components include silicon, silicon carbide, gallium nitride and hydrogenated amorphous silicon. These components are resistant to the damage caused by ionizing and high-energy radiations, and gamma and neutron radiation emitted by nuclear reactors. They are widely employed in satellites, aircraft and nuclear power plants in the form of switching regulators, microprocessors and power supply devices. Owing to this, they find extensive applications across various industries, including aviation, space, military and defense. 

The global market is primarily being driven by the increasing number of space missions and exploratory activities. In line with this, the rising demand for communication satellites for intelligence, surveillance and reconnaissance (ISR) operations is also providing a boost to the market growth. Radiation-hardened electronics is crucial for protecting electronic equipment from physical damage and failure caused by harmful radiations in outer space. Furthermore, widespread product adoption for manufacturing power management devices is creating a positive impact on the market. These electronics are also used to manufacture diodes, transistors and metal-oxide-semiconductor field-effect transistors (MOSFET) for various defense and military applications. Additionally, various technological advancements, such as the development of highly reliable integrated circuits and improvements in the field-programmable gate array (FPGA) technology, are creating a positive outlook for the market. Other factors, including significant growth in the electronics industry and extensive research and development (R&D) activities, are projected to drive the market further. 

Key Market Segmentation:

IMARC Group provides an analysis of the key trends in each sub-segment of the global radiation-hardened electronics market report, along with forecasts at the global, regional and country level from 2023-2028. Our report has categorized the market based on product type, material type, technique, component type and application.

Breakup by Product Type:

• Custom Made
• Commercial-Off-the-Shelf
   

Breakup by Material Type:

• Silicon
• Silicon Carbide
• Gallium Nitride
• Others
   

Breakup by Technique:

• Radiation Hardening by Design (RHBD)
• Radiation Hardening by Process (RHBP)
• Radiation Hardening by Software (RHBS)
   

Breakup by Component Type:

• Power Management
• Application Specific Integrated Circuit
• Logic
• Memory
• Field-Programmable Gate Array
• Others
   

Breakup by Application:

• Space Satellites
• Commercial Satellites
• Military
• Aerospace and Defense
• Nuclear Power Plants
• Others
   

Breakup by Region:

• North America
  • United States
  • Canada
• Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Australia
  • Indonesia
  • Others
• Europe
  • Germany
  • France
  • United Kingdom
  • Italy
  • Spain
  • Russia
  • Others
• Latin America
  • Brazil
  • Mexico
  • Others
• Middle East and Africa
   

Competitive Landscape:

The report has also analysed the competitive landscape of the market with some of the key players being Analog Devices Inc., BAE Systems plc, Cobham Plc (Advent International), Data Device Corporation (Transdigm Group Incorporated), Honeywell International Inc., Microchip Technology Inc, STMicroelectronics, Texas Instruments Incorporated, The Boeing Company, Xilinx Inc., etc.

Report Coverage: