Market Overview:
The global silicon wafer reclaim market reached a value of US$ 487.1 Million in 2021. Looking forward, IMARC Group expects the market to reach a value of US$ 793.4 Million by 2027, exhibiting a growth rate (CAGR) of 8.10% during 2022-2027. Keeping in mind the uncertainties of COVID-19, we are continuously tracking and evaluating the direct as well as the indirect influence of the pandemic on different end use industries. These insights are included in the report as a major market contributor.
Silicon wafer reclaim refers to prime wafer that can be reprocessed and re-polished for different uses. They employ multi-step procedures, such as sorting, stripping, polishing, lapping, grinding, cleaning, and inspection. As compared to conventional wafers, silicon wafers are thinner in size, offer better performance and are more cost-effective as they can be repurposed. Consequently, they are used to produce microelectromechanical systems (MEMS), optoelectronic devices, solar and photoelectric cells and integrated circuits. At present, silicon wafers reclaim are commercially categorized based on their varying diameter types.
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Note: Information in the above chart consists of dummy data and is only shown here for representation purpose. Kindly contact us for the actual market size and trends.
Silicon Wafer Reclaim Market Trends:
The global silicon wafer reclaim market is majorly being driven by a significant expansion in the electronics sector, along with the increasing demand for various consumer electronics, including smartphones, laptops, and desktops. In line with this, silicon wafer reclaim is widely incorporated in semiconductors and microchips, which are further adopted to manufacture integrated circuits, solar cells, and photoelectric cells to ensure high operational efficiency, while decreasing the production costs. Additionally, the rising environmental concerns have prompted governments of various nations to undertake several initiatives that promote solar installations, which, in turn, is acting as another major growth-inducing factor. Besides this, rapid technological innovations, such as the introduction of advanced processing solutions that aid in mitigating the risk of defect formation in silicon wafers is also inflating the overall product sales across the globe. Moreover, the shifting inclination of manufacturers toward larger sizes of silicon wafer as it enables the fabrication of multiple chips on a single wafer, is positively impacting the market growth. Other factors, such as continuous investments in research and development (R&D) activities, along with frequent mergers and acquisitions (M&A) amongst key players to launch simplified reclaiming methodologies to overcome production process complexities, are creating a positive outlook for the market.
Key Market Segmentation:
IMARC Group provides an analysis of the key trends in each sub-segment of the global silicon wafer reclaim market, along with forecasts at the global, regional and country level from 2022-2027. Our report has categorized the market based on diameter type, application and industry vertical.
Breakup by Diameter Type:
- 150 mm
- 200 mm
- 300 mm
- Others
Breakup by Application:
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Note: Information in the above chart consists of dummy data and is only shown here for representation purpose. Kindly contact us for the actual market size and trends.
- Solar Cells
- Integrated Circuits
- Others
Breakup by Industry Vertical:
- Electronics
- Automotive
- Aerospace and Defense
- Mining and Construction
- Others
Breakup by Region:
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- North America
- Asia-Pacific
- China
- Japan
- India
- South Korea
- Australia
- Indonesia
- Others
- Europe
- Germany
- France
- United Kingdom
- Italy
- Spain
- Russia
- Others
- Latin America
- Middle East and Africa
Competitive Landscape:
The competitive landscape of the industry has also been examined along with the profiles of the key players being DSK Technologies Pte Ltd., NanoSILICON Inc., Nippon Chemi-Con Corporation, NOVA Electronic Materials LLC, Optim Wafer Services, Phoenix Silicon International Corporation, Pure Wafer, RS Technologies Co. Ltd., Shinryo Corporation (Mitsubishi Chemical Corporation), Silicon Materials Inc., Silicon Specialists LLC and Silicon Valley Microelectronics Inc.
Report Coverage:
Report Features |
Details |
Base Year of the Analysis |
2021 |
Historical Period |
2016-2021 |
Forecast Period |
2022-2027 |
Units |
US$ Million |
Segment Coverage |
Diameter Type, Application, Industry Vertical, Region |
Region Covered |
Asia Pacific, Europe, North America, Latin America, Middle East and Africa |
Countries Covered |
United States, Canada, Germany, France, United Kingdom, Italy, Spain, Russia, China, Japan, India, South Korea, Australia, Indonesia, Brazil, Mexico |
Companies Covered |
DSK Technologies Pte Ltd., NanoSILICON Inc., Nippon Chemi-Con Corporation, NOVA Electronic Materials LLC, Optim Wafer Services, Phoenix Silicon International Corporation, Pure Wafer, RS Technologies Co. Ltd., Shinryo Corporation (Mitsubishi Chemical Corporation), Silicon Materials Inc., Silicon Specialists LLC and Silicon Valley Microelectronics Inc. |
Customization Scope |
10% Free Customization |
Report Price and Purchase Option |
Single User License: US$ 2499
Five User License: US$ 3499
Corporate License: US$ 4499 |
Post-Sale Analyst Support |
10-12 Weeks |
Delivery Format |
PDF and Excel through Email (We can also provide the editable version of the report in PPT/Word format on special request) |