The United States radiation-hardened electronics market exhibited moderate growth during 2015-2020. Looking forward, IMARC Group expects the market to exhibit stable growth during 2021-2026. Keeping in mind the uncertainties of COVID-19, we are continuously tracking and evaluating the direct as well as the indirect influence of the pandemic on different end use sectors. These insights are included in the report as a major market contributor.
Radiation-hardened electronics comprise electronic components, as well as products and packages that are utilized for high-altitude applications. These electronics are manufactured using silicon carbide, hydrogenated amorphous silicon and gallium nitride. They are resistant to damages caused by gamma and neutron radiation and ionizing and high-energy radiation emitted by nuclear reactors. Consequently, they are used in aircraft, satellites and nuclear power plants in the form of switching regulators, power supply devices and microprocessors.
The US military has developed integrated technology to create advanced weapons. These weapons rely on radiation-hardened electronics as an EMP blast or an electromagnetic discharge to wipe out all the electronics in that radius and increase the collateral damage. Besides this, the presence of defense and space research institutes across the country acts as another growth-inducing factor. However, the coronavirus disease (COVID-19) outbreak and the subsequent lockdown restrictions imposed by the US Government have severely impacted the supply chains and disrupted the manufacturing operations. This has negatively affected the market growth, but it will witness normalcy once these restrictions are uplifted.
Key Market Segmentation:
IMARC Group provides an analysis of the key trends in each sub-segment of the United States radiation-hardened electronics market, along with forecasts at the country and regional level from 2021-2026. Our report has categorized the market based on product type, material type, technique, component type and application.
Breakup by Product Type:
Breakup by Material Type:
Breakup by Technique:
Radiation Hardening by Design (RHBD)
Radiation Hardening by Process (RHBP)
Radiation Hardening by Software (RHBS)
Breakup by Component Type:
Application Specific Integrated Circuit
Field-Programmable Gate Array
Breakup by Application:
Aerospace and Defense
Nuclear Power Plants
Breakup by Region:
The competitive landscape of the industry has also been examined along with the profiles of the key players.
Base Year of the Analysis
Product Type, Material Type, Technique, Component Type, Application, Region
Northeast, Midwest, South, West
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Key Questions Answered in This Report:
How has the United States radiation-hardened electronics market performed so far and how will it perform in the coming years?
What has been the impact of COVID-19 on the United States radiation-hardened electronics market?
What are the key regional markets?
What is the breakup of the market based on the product type?
What is the breakup of the market based on the material type?
What is the breakup of the market based on the technique?
What is the breakup of the market based on the component type?
What is the breakup of the market based on the application?
What are the various stages in the value chain of the industry?
What are the key driving factors and challenges in the industry?
What is the structure of the United States radiation-hardened electronics market and who are the key players?
What is the degree of competition in the industry?
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