Global Atomic Layer Deposition Equipment Market to Reach US$ 22.6 Billion by 2032, Propelled by Escalating Demand for Semiconductor Chips

According to the latest report by IMARC Group, titled “Atomic Layer Deposition Equipment Market Report by Product (Metal ALD, Aluminum Oxide ALD, Plasma Enhanced ALD, Catalytic ALD, and Others), Application (Semiconductors, Solar Devices, Electronics, Medical Equipment, and Others), and Region 2024-2032”, the global atomic layer deposition equipment market size reached US$ 6.6 Billion in 2023.  Atomic layer deposition (ALD) equipment refer to the devices that are used to coat objects in thin layers of a substance onto a substrate during semiconductor fabrication. ALD is a process in which a substrate surface is exposed to alternating precursors that do not overlap but are sequentially injected into the substrate to produce thin conformal films. Atomic deposition layers are used to create gas or vapor barriers depending on the material or product that requires an isolation film. ALD equipment is an integral part of the production of semiconductor devices as well as components involved in the manufacturing of a range of tools for the synthesis of nanomaterials. ALD equipment is generally employed for chroma adjustment and film-preventing Ag sulfide in the fabrication of LEDs. Therefore, ALD equipment is extensively used in various products, such as displays, data storage devices, and small electronic components.

Global Atomic Layer Deposition Equipment Market Trends:

The global market is majorly driven by the escalating demand for semiconductor chips for electronic products. This can be attributed to considerable growth in the electrical and electronic industry. In addition to this, the emerging trend of device miniaturization resulting in a higher uptake of small electronics and machinery is propelling the market. Also, the rapid utilization of innovative designs and materials, such as plasma-enhanced ALD for advanced chip manufacturing processes, is also positively impacting the market. In line with this, continual technological advancements, such as the introduction of spatial ALD for flexible electronics and 3D printed reactor for ALD, is providing an impetus to the market. Moreover, the widespread adoption of IC products made from semiconductor technology, such as GPUs, CPUs, NAND flash memory, DRAM, image sensors, and power management devices, is further fueling the market. Apart from this, favorable government initiatives promoting smart cities having an electronics-based infrastructure are creating lucrative growth opportunities in the market. The market is further propelled by the expansion of electronics and automotive manufacturing facilities across the globe. Some of the other factors contributing to the market include rapid urbanization and industrialization, inflating disposable income levels, the launch of 5G technology, the emergence of Industry 4.0, and extensive research and development (R&D) activities. On account of the aforementioned factors, the market is anticipated to reach a value of US$ 22.6 Billion by 2032, exhibiting a CAGR of 14.5% during 2024-2032.

Market Summary:

• Based on the product, the market has been segmented into Metal ALD, Aluminum Oxide ALD, Aluminum Oxide ALD, Plasma Enhanced ALD, Catalytic ALD, and others.
• On the basis of the application, the market has been divided into semiconductors, solar devices, electronics, medical equipment, and others.
• On the geographical front, the market has been segregated into North America (the United States and Canada), Asia-Pacific (China, Japan, India, South Korea, Australia, Indonesia and others), Europe (Germany, France, the United Kingdom, Italy, Spain, Russia and others), Latin America (Brazil, Mexico and others), and Middle East and Africa.
• The competitive landscape of the market has been studied in the report with the detailed profiles of the key players. Some of these players include Arradiance LLC, ASM International, Beneq Oy, CVD Equipment Corporation, Forge Nano Inc., Kurt J. Lesker Company, Lam Research Corporation, Oxford Instruments plc, Picosun Oy (Applied Materials Inc.), SENTECH Instruments GmbH, Veeco Instruments Inc., Wonik IPS Co. Ltd., and Tokyo Electron Limited.
   

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