Global Silicon Wafer Reclaim Market to Reach US$ 1,053.1 Million by 2032, Impelled by Significant Growth in Electronics Industry

July 22, 2022 | Electronics and Semiconductors

According to the latest report by IMARC Group, titled “Silicon Wafer Reclaim Market Report by Diameter Type (150 mm, 200 mm, 300 mm, and Others), Application (Solar Cells, Integrated Circuits, and Others), Industry Vertical (Electronics, Automotive, Aerospace and Defense, Mining and Construction, and Others), and Region 2024-2032," the global silicon wafer reclaim market reached a value of US$ 578.4 Million in 2023. Silicon wafer reclaim is the restoration of silicon wafers by employing a multi-step technique, including sorting, stripping, lapping and grinding, polishing, cleaning, and inspecting. It removes surplus material from the silicon wafer with a combination of wet and dry processes to strip and polish it back to its original condition. Silicon wafer reclaim is widely used in the manufacturing of optoelectronic devices, solar and photoelectric cells, microelectromechanical systems (MEMS), and integrated circuits. As compared to conventional wafers, silicon wafers offer better performance, are thinner in size, and are more cost-effective as they can be repurposed.


Global Silicon Wafer Reclaim Market Trends:

The significant growth in the electronics industry across the globe is creating a positive outlook for the market. Silicon wafer reclaim is used in manufacturing consumer electronic goods, such as smartphones, tablets, and laptops, due to its lightweight and reclaimed properties. Additionally, the increasing inclination toward a high generation of solar energy and the expanding number of solar panel installations, owing to the rising government initiatives supporting renewable energy, are favoring the market growth. Apart from this, the introduction of advanced processing solutions that help mitigate the risks of defect formation in silicon wafers is providing an impetus to the market growth. In line with this, manufacturers are focusing on engineering larger sizes of silicon wafers to enable the fabrication of multiple chips on a single wafer, which, in turn, is propelling the market growth. Other factors, including rising expenditure capacities of consumers, extensive research and development (R&D) activities, and the introduction of simplified reclaiming methodologies by key players to overcome production process complexities, are supporting the market growth. On account of the aforementioned factors, the market value is expected to reach US$ 1,053.1 Million by 2032, exhibiting a CAGR of 6.7% during 2024-2032. 


Market summary

  • On the basis of the diameter type, the market has been classified into 150 mm, 200 mm, 300 mm, and others.
  • Based on the application, the market has been divided into solar cells, integrated circuits, and others.
  • On the basis of the industry vertical, the market has been categorized into electronics, automotive, aerospace and defense, mining and construction, and others.
  • On region basis, the market has been categorized into North America (the United States and Canada), Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia and Others), Europe (Germany, France, the United Kingdom, Italy, Spain, Russia and Others) Latin America (Brazil, Mexico and Others), and Middle East and Africa.
  • The competitive landscape of the industry has also been examined, with some of the key players being DSK Technologies Pte Ltd., NanoSILICON Inc., Nippon Chemi-Con Corporation, NOVA Electronic Materials LLC, Optim Wafer Services, Phoenix Silicon International Corporation, Pure Wafer, RS Technologies Co. Ltd., Shinryo Corporation (Mitsubishi Chemical Corporation), Silicon Materials Inc., Silicon Specialists LLC and Silicon Valley Microelectronics Inc.


Report Coverage:

Report Features Details
Base Year of the Analysis 2023
Historical Period 2018-2023
Forecast Period 2024-2032
Units US$ Million
Segment Coverage Diameter Type, Application, Industry Vertical, Region
Region Covered  Asia Pacific, Europe, North America, Latin America, Middle East and Africa
Countries Covered United States, Canada, Germany, France, United Kingdom, Italy, Spain, Russia, China, Japan, India, South Korea, Australia, Indonesia, Brazil, Mexico
Companies Covered DSK Technologies Pte Ltd., NanoSILICON Inc., Nippon Chemi-Con Corporation, NOVA Electronic Materials LLC, Optim Wafer Services, Phoenix Silicon International Corporation, Pure Wafer, RS Technologies Co. Ltd., Shinryo Corporation (Mitsubishi Chemical Corporation), Silicon Materials Inc., Silicon Specialists LLC and Silicon Valley Microelectronics Inc.
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Global Silicon Wafer Reclaim Market to Reach US$ 1,053.1 Million by 2032, Impelled by Significant Growth in Electronics Industry
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