Market Overview:
The global potting compound market size reached US$ 3.3 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 4.7 Billion by 2032, exhibiting a growth rate (CAGR) of 3.8% during 2024-2032.
Report Attribute
|
Key Statistics
|
Base Year
|
2023
|
Forecast Years
|
2024-2032
|
Historical Years
|
2018-2023
|
Market Size in 2023
|
US$ 3.3 Billion |
Market Forecast in 2032
|
US$ 4.7 Billion |
Market Growth Rate 2024-2032 |
3.8% |
Potting compounds are liquid resins that flow over a circuit board to protect the electronic components against moisture, heat, vibration, impact, and environmental factors. They comprise epoxy, polyurethane, and silicone to provide high adhesion to electronic products. They help prevent short circuits, offer increased chemical protection in complex assemblies, and provide mechanical shock and vibration resistance in harsh environmental conditions. In addition, they offer high-temperature resistance while preventing the cracking or yellowing of electronic devices due to ultraviolet (UV) radiation. As a result, potting compounds are widely used in automotive, electronics, aerospace, and power industries across the globe.
Potting Compound Market Trends:
At present, there is a rise in the demand for potting compounds in the electrical and electronics industry to protect products from moisture and shock. This, along with the growing miniaturization of electronic components to develop small portable and handheld computer devices, represents one of the key factors driving the market. Besides this, the rising trend of vehicle electrification in the transportation sector to reduce greenhouse gas emissions is contributing to the growth of the market. Additionally, the increasing integration of electronic systems in vehicles, such as navigation, infotainment, and advanced driver-assistance systems (ADAS), is offering lucrative growth opportunities to industry investors. Apart from this, the growing awareness among the masses about the benefits of using potting compounds to produce electronic devices, such as high viscosity and semi-rigid and flexible compositions, is positively influencing the market. Moreover, there is an increase in the demand for electronic devices, such as semiconductors, capacitors, transformers, and solenoids, around the world. This, coupled with the burgeoning electronic industry, is propelling the growth of the market. Furthermore, the rising demand for potting compounds in the aerospace industry is bolstering the growth of the market.
Note: Information in the above chart consists of dummy data and is only shown here for representation purpose. Kindly contact us for the actual market size and trends.
Key Market Segmentation:
IMARC Group provides an analysis of the key trends in each sub-segment of the global potting compound market report, along with forecasts at the global, regional and country level from 2024-2032. Our report has categorized the market based on resin type, curing technology and end user.
Breakup by Resin Type:
- Epoxy
- Polyurethane
- Silicone
- Polyester
- Polyamide
- Polyolefin
- Acrylics
Breakup by Curing Technology:
Note: Information in the above chart consists of dummy data and is only shown here for representation purpose. Kindly contact us for the actual market size and trends.
- UV Curing
- Thermal Curing
- Room Temperature Curing
Breakup by End User:
- Electronics
- Aerospace
- Automotive
- Industrial
- Others
Breakup by Region:
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- North America
- Asia-Pacific
- China
- Japan
- India
- South Korea
- Australia
- Indonesia
- Others
- Europe
- Germany
- France
- United Kingdom
- Italy
- Spain
- Russia
- Others
- Latin America
- Middle East and Africa
Competitive Landscape:
The competitive landscape of the industry has also been examined along with the profiles of the key players being 3M Company, Aremco Products Inc., DuPont de Nemours Inc., Dymax Corporation, EFI Polymers, Electrolube (Element Solutions Inc), Henkel AG & Co. KGaA, Huntsman International LLC (Huntsman Corporation), LORD Corporation (Parker Hannifin Corporation), Master Bond Inc., MG Chemicals, RBC Industries Inc and WEVO-CHEMIE GmbH.
Report Coverage:
Report Features |
Details |
Base Year of the Analysis |
2023 |
Historical Period |
2018-2023 |
Forecast Period |
2024-2032 |
Units |
US$ Billion |
Segment Coverage |
Resin Type, Curing Technology, End User, Region |
Region Covered |
Asia Pacific, Europe, North America, Latin America, Middle East and Africa |
Countries Covered |
United States, Canada, Germany, France, United Kingdom, Italy, Spain, Russia, China, Japan, India, South Korea, Australia, Indonesia, Brazil, Mexico |
Companies Covered |
3M Company, Aremco Products Inc., DuPont de Nemours Inc., Dymax Corporation, EFI Polymers, Electrolube (Element Solutions Inc), Henkel AG & Co. KGaA, Huntsman International LLC (Huntsman Corporation), LORD Corporation (Parker Hannifin Corporation), Master Bond Inc., MG Chemicals, RBC Industries Inc, WEVO-CHEMIE GmbH |
Customization Scope |
10% Free Customization |
Report Price and Purchase Option |
Single User License: US$ 3899
Five User License: US$ 4899
Corporate License: US$ 5899 |
Post-Sale Analyst Support |
10-12 Weeks |
Delivery Format |
PDF and Excel through Email (We can also provide the editable version of the report in PPT/Word format on special request) |