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The global semiconductor packaging market reached a value of US$ 29.7 Billion in 2021. Looking forward, IMARC Group expects the market to reach US$ 47.92 Billion by 2027, exhibiting at a CAGR of 7.70% during 2022-2027. Keeping in mind the uncertainties of COVID-19, we are continuously tracking and evaluating the direct as well as the indirect influence of the pandemic on different end use sectors. These insights are included in the report as a major market contributor.
Semiconductor packaging is a container used for protecting the integrated circuit (IC) chips from surrounding environments and houses one or more discrete and fragile semiconductor components. Embedded die, flip chip, fan-in wafer-level and fan-out wafer-level packaging are some of the commonly available semiconductor packaging variants that are manufactured using plastic, glass and metallic materials. They are widely used to provide a supporting case that prevents physical damage and corrosion to logic units, silicon wafers and memory devices during the final stage of the semiconductor manufacturing process. Semiconductor packaging also aids in protecting the electronic system from radiofrequency noise emission, cooling, electrostatic discharge and mechanical damage. As a result, it finds extensive application across various industries, such as automotive, medical, telecommunications, aerospace and defense.
The widespread product utilization in the consumer electronics industry is one of the key factors driving the growth of the market. Semiconductors are widely used in lightweight, small and portable devices, such as smartphones, tablets, smartwatches, fitness bands and communication devices. Additionally, significant growth in the automotive industry is favoring the market growth. Semiconductor ICs are widely used in various products, such as anti-lock braking systems (ABS), infotainment, airbag control, collision detection technology and windows. Moreover, the increasing utilization of artificial intelligence (AI) and Internet of Things (IoT)-integrated industrial devices with high power requirements is also enhancing the demand for semiconductor packaging. In line with this, rising environmental consciousness among the masses and the increasing need for reducing electronic waste is positively impacting the market growth. Other factors, including the widespread product adoption in the aerospace industry to improve the thermal performance of the aircraft components, along with the increasing demand for semiconductor packaging in medical devices, such as ultrasound devices, mobile X-ray systems and patient monitors, are anticipated to drive the market toward growth.
IMARC Group provides an analysis of the key trends in each sub-segment of the global semiconductor packaging market, along with forecasts at the global, regional and country level from 2022-2027. Our report has categorized the market based on type, packaging material, technology and end user.
Breakup by Type:
Breakup by Packaging Material:
Breakup by Technology:
Breakup by End User:
Breakup by Region:
The competitive landscape of the industry has also been examined along with the profiles of the key players being Amkor Technology Inc., ASE Group, ChipMOS Technologies Inc., Fujitsu Limited, Intel Corporation, International Business Machines Corporation, JCET Group Co. Ltd., Powertech Technology Inc., Qualcomm Incorporated, Samsung Electronics Co. Ltd., STMicroelectronics, Taiwan Semiconductor Manufacturing Company Limited and Texas Instruments Incorporated.
|Base Year of the Analysis||2021|
|Segment Coverage||Type, Packaging Material, Technology, End User, Region|
|Region Covered||Asia Pacific, Europe, North America, Latin America, Middle East and Africa|
|Countries Covered||United States, Canada, Germany, France, United Kingdom, Italy, Spain, Russia, China, Japan, India, South Korea, Australia, Indonesia, Brazil, Mexico|
|Companies Covered||Amkor Technology Inc., ASE Group, ChipMOS Technologies Inc., Fujitsu Limited, Intel Corporation, International Business Machines Corporation, JCET Group Co. Ltd., Powertech Technology Inc., Qualcomm Incorporated, Samsung Electronics Co. Ltd., STMicroelectronics, Taiwan Semiconductor Manufacturing Company Limited and Texas Instruments Incorporated.|
|Customization Scope||10% Free Customization|
|Report Price and Purchase Option||Single User License: US$ 2299
Five User License: US$ 3399
Corporate License: US$ 4499
|Post-Sale Analyst Support||10-12 Weeks|
|Delivery Format||PDF and Excel through Email (We can also provide the editable version of the report in PPT/Word format on special request)|
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