Market Overview:

The global thermal interface materials market reached a value of US$ 2.87 Billion in 2021. Looking forward, IMARC Group expects the market to reach US$ 5.03 Billion by 2027, exhibiting at a CAGR of 9.7% during 2022-2027. Keeping in mind the uncertainties of COVID-19, we are continuously tracking and evaluating the direct as well as the indirect influence of the pandemicon different end use industries. These insights are included in the report as a major market contributor.

Thermal interface materials (TIMs) refer to various products that are used for facilitating dissipation and transfer of heat in electronic devices. They act as an insertion material between two mechanically mated surfaces, such as the heat-generating chip and the dissipating device. Some of the common types of TIMs include gap filler pads, graphite films, adhesives and greases, phase-change materials, thermally conductive fabrics and rubber, and green heat-conducting sponges. They disperse the heat and bring the electronic device to the ambient temperature to ensure optimal functioning. Owing to this, they find application in the manufacturing of semiconductor packaging, communication and consumer devices, power electronics and automobile components. 

Rapid industrialization, especially in the emerging economies, along with a significant increase in the demand for consumer electronics across the globe, is one of the key factors driving the growth of the market. In line with this, owing to the ongoing trend of sustainability, automotive manufacturers are incorporating TIMs in music systems and interior automation components to minimize greenhouse gas (GHG) emissions and energy consumption. Furthermore, widespread product adoption in the electronics industry is also providing a boost to the market growth. TMIs are increasingly utilized to manufacture compact, portable, energy-efficient and durable light-emitting diode (LED) lights that are used for both residential and industrial sectors. Additionally, various technological advancements and product innovations, such as the development of nanodiamonds and the integration of electronic devices with the Internet of Things (IoT), is creating a positive impact on the market growth. Other factors, including the growing demand for miniaturized devices and the utilization of multi-functional TMIs, are projected to drive the market further. 

Key Market Segmentation:

IMARC Group provides an analysis of the key trends in each sub-segment of the global thermal interface materials market, along with forecasts at the global, regional and country level from 2022-2027. Our report has categorized the market based on product type and application.

Breakup by Product Type:

• Tapes and Films
• Elastomeric Pads
• Greases and Adhesives
• Phase Change Materials
• Metal Based Materials
• Others
   

Breakup by Application:

• Telecom
• Computer
• Medical Devices
• Industrial Machinery
• Consumer Durables
• Automotive Electronics
• Others
   

Breakup by Region:

• North America
  • United States
  • Canada
• Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Australia
  • Indonesia
  • Others
• Europe
  • Germany
  • France
  • United Kingdom
  • Italy
  • Spain
  • Russia
  • Others
• Latin America
  • Brazil
  • Mexico
  • Others
• Middle East and Africa

Competitive Landscape:

The report has also analysed the competitive landscape of the market with some of the key players being 3M Company, Dow Inc., Henkel AG & Co. KGaA, Honeywell International Inc., Indium Corporation, Kitagawa Industries America Inc., Laird Technologies Inc. Momentive Performance Materials Inc., Parker-Hannifin Corporation, Zalman Tech Co. Ltd., etc.

Report Coverage: