The global thermal interface materials market grew at a CAGR of around 12% during 2014-2019. Thermal interface materials (TIMs) refer to various products that are used for facilitating dissipation and transfer of heat in electronic devices. They act as an insertion material between two mechanically mated surfaces, such as the heat-generating chip and the dissipating device. Some of the common types of TIMs include gap filler pads, graphite films, adhesives and greases, phase-change materials, thermally conductive fabrics and rubber, and green heat-conducting sponges. They disperse the heat and bring the electronic device to the ambient temperature to ensure optimal functioning. Owing to this, they find application in the manufacturing of semiconductor packaging, communication and consumer devices, power electronics and automobile components.
Rapid industrialization, especially in the emerging economies, along with a significant increase in the demand for consumer electronics across the globe, is one of the key factors driving the growth of the market. In line with this, owing to the ongoing trend of sustainability, automotive manufacturers are incorporating TIMs in music systems and interior automation components to minimize greenhouse gas (GHG) emissions and energy consumption. Furthermore, widespread product adoption in the electronics industry is also providing a boost to the market growth. TMIs are increasingly utilized to manufacture compact, portable, energy-efficient and durable light-emitting diode (LED) lights that are used for both residential and industrial sectors. Additionally, various technological advancements and product innovations, such as the development of nanodiamonds and the integration of electronic devices with the Internet of Things (IoT), is creating a positive impact on the market growth. Other factors, including the growing demand for miniaturized devices and the utilization of multi-functional TMIs, are projected to drive the market further. Looking forward, IMARC Group expects the global thermal interface materials market to continue its strong growth during the next five years.
IMARC Group provides an analysis of the key trends in each sub-segment of the global thermal interface materials market report, along with forecasts for growth at the global, regional and country-level from 2020-2025. Our report has categorized the market based on region, product type, and application.
Breakup by Product Type:
Breakup by Application:
Breakup by Region:
The report has also analysed the competitive landscape of the market with some of the key players being 3M Company, Dow Inc., Henkel AG & Co. KGaA, Honeywell International Inc., Indium Corporation, Kitagawa Industries America Inc., Laird Technologies Inc. Momentive Performance Materials Inc., Parker-Hannifin Corporation, Zalman Tech Co. Ltd., etc.
Key Questions Answered in This Report:
Due to the coronavirus disease (COVID-19) outbreak and lockdowns imposed by governments of numerous countries, the operational efficiency of several manufacturing units has declined. This, in turn, is negatively impacting the market growth.
The global thermal interface materials market was worth around US$ 1.3 Billion in 2019.
According to the estimates by IMARC Group, the global thermal interface materials market will exhibit strong growth during the next five years.
Rapid industrialization, especially in the developing economies, the escalating demand for miniaturized devices and the increasing utilization of multi-functional thermal interface materials (TIMs) are among the key factors impelling the market growth.
With the growing environmental concerns, there is a rise in the utilization of TIMs in the production of light-emitting diode (LED) lights and automotive components. This, along with the development of nanodiamonds, represents one of the major trends in the market.
Based on the product type, the market has been divided into tapes and films, elastomeric pads, greases and adhesives, phase change materials, metal-based materials, and others.
On the basis of the application, the market has been categorized into telecom, computer, medical devices, industrial machinery, consumer durables, automotive electronics and others.
Region-wise, the market has been segmented into North America (the United States and Canada); Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia and others); Europe (the United Kingdom, Germany, France, Italy, Spain, Russia and others); Latin America (Brazil, Mexico and others); and Middle East and Africa.
Leading industry players are 3M Company, Dow Inc., Henkel AG & Co. KGaA, Honeywell International Inc., Indium Corporation, Kitagawa Industries America Inc., Laird Technologies Inc. Momentive Performance Materials Inc., Parker-Hannifin Corporation and Zalman Tech Co. Ltd.
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