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The global advanced packaging market was valued at US$ 32.53 Billion in 2021.
We expect the global advanced packaging market to exhibit a CAGR of 11.60% during 2022-2027.
The sudden outbreak of the COVID-19 pandemic had led to the implementation of stringent lockdown regulations across several nations resulting in temporary closure of various end-use industries for advanced packaging.
The rising consumer electronics sector, along with the growing adoption of advanced packaging to increase the functionality of various electronic devices, ensure lower power consumption, provide better chip connectivity, etc., is primarily driving the global advanced packaging market.
Based on the type, the global advanced packaging market has been segregated into flip-chip ball grid array, flip chip CSP, wafer level CSP, 5D/3D, fan out WLP, and others. Among these, flip-chip ball grid array currently holds the largest market share.
Based on the end use, theglobal advanced packaging market can be bifurcated into consumer electronics, automotive, industrial, healthcare, aerospace and defense, and others. Currently, the consumer electronics industry exhibits a clear dominance in the market.
On a regional level, the market has been classified into North America, Asia-Pacific, Europe, Latin America, and Middle East and Africa, where Asia-Pacific currently dominates the global market.
Some of the major players in the global advanced packaging market include Advanced Semiconductor Engineering Inc., Amkor Technology Inc., Analog Devices Inc., Brewer Science, ChipMOS Technologies Inc., Microchip Technology Inc., Powertech Technology Inc., Samsung Electronics Co. Ltd, SÜSS MicroTec SE, Taiwan Semiconductor Manufacturing Company Limited, Texas Instruments Incorporated, and Universal Instruments Corporation (CBA Group Inc.).
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