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The global advanced packaging market size reached US$ 32.53 Billion in 2021. Looking forward, IMARC Group expects the market to reach US$ 67.04 Billion by 2027, exhibiting a growth rate (CAGR) of 11.60% during 2022-2027. Keeping in mind the uncertainties of COVID-19, we are continuously tracking and evaluating the direct as well as the indirect influence of the pandemic on different end use industries. These insights are included in the report as a major market contributor.
Advanced packaging is the interconnection and aggregation of components that encloses metallic parts and various devices, including wafers, logic units, and memory, to protect them from physical damage and corrosion during the final procedure of semiconductor manufacturing. It encompasses 2.5D, 3D-IC, system-in, and fan-out-wafer-level-package as a combination of different techniques. These packaging methods are implemented after determining multiple parameters, such as power consumption, operating conditions, measurable size, and costs. Advanced packaging increases the functionality of various electronic devices, ensures lower power consumption, provides better chip connectivity, and shields silicon chips from mechanical stresses or vibrations. As a result, it is extensively used in various electronic gadgets and devices.
The global advanced packaging market is primarily driven by the rapid expansion in the electronics sector, along with the increasing demand for various consumer electronics, including wearables, desktops, smartphones, laptops, and miniaturized devices. In line with this, manufacturers are extensively utilizing advanced packaging to accomplish delicate patterning in wafers by reducing integrated circuit (IC) sizes in the semiconductor, which is acting as another growth-inducing factor. Furthermore, the widespread adoption of nano-sized robotic surgery equipment and sophisticated wearable devices has encouraged leading companies to rely on advanced packaging techniques over conventional procedures to promote system optimization, which is contributing to the market growth. Additionally, the inclination toward fan-out wafer-level packaging, owing to its several benefits, including superior thermal performance, increased wafer-level yield, easier packaging system, and the acceptance of three-dimensional (3D) circuits, is impelling the market growth. Apart from this, strategic collaborations amongst key players to enhance product efficacy and the large-scale usage of artificial intelligence (AI), deep learning, and machine learning (ML) to combine processing elements and memories through high-speed interconnect are supporting the market growth.
IMARC Group provides an analysis of the key trends in each sub-segment of the global advanced packaging market report, along with forecasts at the global, regional and country level from 2022-2027. Our report has categorized the market based on type and end use.
Breakup by Type:
Breakup by End Use:
Breakup by Region:
The competitive landscape of the industry has also been examined along with the profiles of the key players being Advanced Semiconductor Engineering Inc., Amkor Technology Inc., Analog Devices Inc., Brewer Science, ChipMOS Technologies Inc., Microchip Technology Inc., Powertech Technology Inc., Samsung Electronics Co. Ltd, SÜSS MicroTec SE, Taiwan Semiconductor Manufacturing Company Limited, Texas Instruments Incorporated and Universal Instruments Corporation (CBA Group Inc.).
|Base Year of the Analysis||2021|
|Segment Coverage||Type, End Use, Region|
|Region Covered||Asia Pacific, Europe, North America, Latin America, Middle East and Africa|
|Countries Covered||United States, Canada, Germany, France, United Kingdom, Italy, Spain, Russia, China, Japan, India, South Korea, Australia, Indonesia, Brazil, Mexico|
|Companies Covered||Advanced Semiconductor Engineering Inc., Amkor Technology Inc., Analog Devices Inc., Brewer Science, ChipMOS Technologies Inc., Microchip Technology Inc., Powertech Technology Inc., Samsung Electronics Co. Ltd, SÜSS MicroTec SE, Taiwan Semiconductor Manufacturing Company Limited, Texas Instruments Incorporated and Universal Instruments Corporation (CBA Group Inc.).|
|Customization Scope||10% Free Customization|
|Report Price and Purchase Option||Single User License: US$ 2499
Five User License: US$ 3499
Corporate License: US$ 4499
|Post-Sale Analyst Support||10-12 Weeks|
|Delivery Format||PDF and Excel through Email (We can also provide the editable version of the report in PPT/Word format on special request)|
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