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Advanced Packaging Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2022-2027

Market Overview:

The global advanced packaging market size reached US$ 32.53 Billion in 2021. Looking forward, IMARC Group expects the market to reach US$ 67.04 Billion by 2027, exhibiting a growth rate (CAGR) of 11.60% during 2022-2027. Keeping in mind the uncertainties of COVID-19, we are continuously tracking and evaluating the direct as well as the indirect influence of the pandemic on different end use industries. These insights are included in the report as a major market contributor.

Advanced packaging is the interconnection and aggregation of components that encloses metallic parts and various devices, including wafers, logic units, and memory, to protect them from physical damage and corrosion during the final procedure of semiconductor manufacturing. It encompasses 2.5D, 3D-IC, system-in, and fan-out-wafer-level-package as a combination of different techniques. These packaging methods are implemented after determining multiple parameters, such as power consumption, operating conditions, measurable size, and costs. Advanced packaging increases the functionality of various electronic devices, ensures lower power consumption, provides better chip connectivity, and shields silicon chips from mechanical stresses or vibrations. As a result, it is extensively used in various electronic gadgets and devices. 

Advanced Packaging Market Trends:

The global advanced packaging market is primarily driven by the rapid expansion in the electronics sector, along with the increasing demand for various consumer electronics, including wearables, desktops, smartphones, laptops, and miniaturized devices. In line with this, manufacturers are extensively utilizing advanced packaging to accomplish delicate patterning in wafers by reducing integrated circuit (IC) sizes in the semiconductor, which is acting as another growth-inducing factor. Furthermore, the widespread adoption of nano-sized robotic surgery equipment and sophisticated wearable devices has encouraged leading companies to rely on advanced packaging techniques over conventional procedures to promote system optimization, which is contributing to the market growth. Additionally, the inclination toward fan-out wafer-level packaging, owing to its several benefits, including superior thermal performance, increased wafer-level yield, easier packaging system, and the acceptance of three-dimensional (3D) circuits, is impelling the market growth. Apart from this, strategic collaborations amongst key players to enhance product efficacy and the large-scale usage of artificial intelligence (AI), deep learning, and machine learning (ML) to combine processing elements and memories through high-speed interconnect are supporting the market growth. 

Key Market Segmentation:

IMARC Group provides an analysis of the key trends in each sub-segment of the global advanced packaging market report, along with forecasts at the global, regional and country level from 2022-2027. Our report has categorized the market based on type and end use.

Breakup by Type:

  • Flip-Chip Ball Grid Array
  • Flip Chip CSP
  • Wafer Level CSP
  • 5D/3D
  • Fan Out WLP
  • Others
     

Breakup by End Use:

  • Consumer Electronics
  • Automotive
  • Industrial
  • Healthcare
  • Aerospace and Defense
  • Others
     

Breakup by Region:

  • North America
    • United States
    • Canada
  • Asia-Pacific
    • China
    • Japan
    • India
    • South Korea
    • Australia
    • Indonesia
    • Others
  • Europe
    • Germany
    • France
    • United Kingdom
    • Italy
    • Spain
    • Russia
    • Others
  • Latin America
    • Brazil
    • Mexico
    • Others
  • Middle East and Africa
     

Competitive Landscape:

The competitive landscape of the industry has also been examined along with the profiles of the key players being Advanced Semiconductor Engineering Inc., Amkor Technology Inc., Analog Devices Inc., Brewer Science, ChipMOS Technologies Inc., Microchip Technology Inc., Powertech Technology Inc., Samsung Electronics Co. Ltd, SÜSS MicroTec SE, Taiwan Semiconductor Manufacturing Company Limited, Texas Instruments Incorporated and Universal Instruments Corporation (CBA Group Inc.).

Report Coverage:

Report Features Details
Base Year of the Analysis 2021
    Historical Period 2016-2021
Forecast Period 2022-2027
Units US$ Billion
Segment Coverage Type, End Use, Region
Region Covered  Asia Pacific, Europe, North America, Latin America, Middle East and Africa
Countries Covered United States, Canada, Germany, France, United Kingdom, Italy, Spain, Russia, China, Japan, India, South Korea, Australia, Indonesia, Brazil, Mexico
Companies Covered Advanced Semiconductor Engineering Inc., Amkor Technology Inc., Analog Devices Inc., Brewer Science, ChipMOS Technologies Inc., Microchip Technology Inc., Powertech Technology Inc., Samsung Electronics Co. Ltd, SÜSS MicroTec SE, Taiwan Semiconductor Manufacturing Company Limited, Texas Instruments Incorporated and Universal Instruments Corporation (CBA Group Inc.).
Customization Scope 10% Free Customization
Report Price and Purchase Option Single User License: US$ 2499
Five User License: US$ 3499
Corporate License: US$ 4499
Post-Sale Analyst Support 10-12 Weeks
Delivery Format PDF and Excel through Email (We can also provide the editable version of the report in PPT/Word format on special request)

 

Key Questions Answered in This Report:

  • How has the global advanced packaging market performed so far and how will it perform in the coming years?
  • What has been the impact of COVID-19 on the global advanced packaging market?
  • What are the key regional markets?
  • What is the breakup of the market based on the type?
  • What is the breakup of the market based on the end use?
  • What are the various stages in the value chain of the industry?
  • What are the key driving factors and challenges in the industry?
  • What is the structure of the global advanced packaging market and who are the key players?
  • What is the degree of competition in the industry?

1    Preface
2    Scope and Methodology

    2.1    Objectives of the Study
    2.2    Stakeholders
    2.3    Data Sources
        2.3.1    Primary Sources
        2.3.2    Secondary Sources
    2.4    Market Estimation
        2.4.1    Bottom-Up Approach
        2.4.2    Top-Down Approach
    2.5    Forecasting Methodology
3    Executive Summary
4    Introduction

    4.1    Overview
    4.2    Key Industry Trends
5    Global Advanced Packaging Market
    5.1    Market Overview
    5.2    Market Performance
    5.3    Impact of COVID-19
    5.4    Market Forecast
6    Market Breakup by Type
    6.1    Flip-Chip Ball Grid Array
        6.1.1 Market Trends
        6.1.2 Market Forecast
    6.2    Flip Chip CSP
        6.2.1 Market Trends
        6.2.2 Market Forecast
    6.3    Wafer Level CSP
        6.3.1 Market Trends
        6.3.2 Market Forecast
    6.4    5D/3D
        6.4.1 Market Trends
        6.4.2 Market Forecast
    6.5    Fan Out WLP
        6.5.1 Market Trends
        6.5.2 Market Forecast
    6.6    Others
        6.6.1 Market Trends
        6.6.2 Market Forecast
7    Market Breakup by End Use
    7.1    Consumer Electronics
        7.1.1 Market Trends
        7.1.2 Market Forecast
    7.2    Automotive
        7.2.1 Market Trends
        7.2.2 Market Forecast
    7.3    Industrial
        7.3.1 Market Trends
        7.3.2 Market Forecast
    7.4    Healthcare
        7.4.1 Market Trends
        7.4.2 Market Forecast
    7.5    Aerospace and Defense
        7.5.1 Market Trends
        7.5.2 Market Forecast
    7.6    Others
        7.6.1 Market Trends
        7.6.2 Market Forecast
8    Market Breakup by Region
    8.1    North America
        8.1.1 United States
           8.1.1.1 Market Trends
           8.1.1.2 Market Forecast
        8.1.2 Canada
           8.1.2.1 Market Trends
           8.1.2.2 Market Forecast
    8.2    Asia-Pacific
        8.2.1 China
           8.2.1.1 Market Trends
           8.2.1.2 Market Forecast
        8.2.2 Japan
           8.2.2.1 Market Trends
           8.2.2.2 Market Forecast
        8.2.3 India
           8.2.3.1 Market Trends
           8.2.3.2 Market Forecast
        8.2.4 South Korea
           8.2.4.1 Market Trends
           8.2.4.2 Market Forecast
        8.2.5 Australia
           8.2.5.1 Market Trends
           8.2.5.2 Market Forecast
        8.2.6 Indonesia
           8.2.6.1 Market Trends
           8.2.6.2 Market Forecast
        8.2.7 Others
           8.2.7.1 Market Trends
           8.2.7.2 Market Forecast
    8.3    Europe
        8.3.1 Germany
           8.3.1.1 Market Trends
           8.3.1.2 Market Forecast
        8.3.2 France
           8.3.2.1 Market Trends
           8.3.2.2 Market Forecast
        8.3.3 United Kingdom
           8.3.3.1 Market Trends
           8.3.3.2 Market Forecast
        8.3.4 Italy
           8.3.4.1 Market Trends
           8.3.4.2 Market Forecast
        8.3.5 Spain
           8.3.5.1 Market Trends
           8.3.5.2 Market Forecast
        8.3.6 Russia
           8.3.6.1 Market Trends
           8.3.6.2 Market Forecast
        8.3.7 Others
           8.3.7.1 Market Trends
           8.3.7.2 Market Forecast
    8.4    Latin America
        8.4.1 Brazil
           8.4.1.1 Market Trends
           8.4.1.2 Market Forecast
        8.4.2 Mexico
           8.4.2.1 Market Trends
           8.4.2.2 Market Forecast
        8.4.3 Others
           8.4.3.1 Market Trends
           8.4.3.2 Market Forecast
    8.5    Middle East and Africa
        8.5.1 Market Trends
        8.5.2 Market Breakup by Country
        8.5.3 Market Forecast
9    SWOT Analysis
    9.1    Overview
    9.2    Strengths
    9.3    Weaknesses
    9.4    Opportunities
    9.5    Threats
10    Value Chain Analysis
11    Porters Five Forces Analysis

    11.1    Overview
    11.2    Bargaining Power of Buyers
    11.3    Bargaining Power of Suppliers
    11.4    Degree of Competition
    11.5    Threat of New Entrants
    11.6    Threat of Substitutes
12    Price Analysis
13    Competitive Landscape

    13.1    Market Structure
    13.2    Key Players
    13.3    Profiles of Key Players
        13.3.1    Advanced Semiconductor Engineering Inc.
           13.3.1.1 Company Overview
           13.3.1.2 Product Portfolio
        13.3.2    Amkor Technology Inc.
           13.3.2.1 Company Overview
           13.3.2.2 Product Portfolio
           13.3.2.3 Financials
           13.3.2.4 SWOT Analysis
        13.3.3    Analog Devices Inc.
           13.3.3.1 Company Overview
           13.3.3.2 Product Portfolio
           13.3.3.3 Financials
           13.3.3.4 SWOT Analysis
        13.3.4    Brewer Science
           13.3.4.1 Company Overview
           13.3.4.2 Product Portfolio
        13.3.5    ChipMOS Technologies Inc.
           13.3.5.1 Company Overview
           13.3.5.2 Product Portfolio
           13.3.5.3 Financials
        13.3.6    Microchip Technology Inc.
           13.3.6.1 Company Overview
           13.3.6.2 Product Portfolio
           13.3.6.3 Financials
           13.3.6.4 SWOT Analysis
        13.3.7    Powertech Technology Inc.
           13.3.7.1 Company Overview
           13.3.7.2 Product Portfolio
           13.3.7.3 Financials
           13.3.7.4 SWOT Analysis
        13.3.8    Samsung Electronics Co. Ltd
           13.3.8.1 Company Overview
           13.3.8.2 Product Portfolio
           13.3.8.3 Financials
           13.3.8.4 SWOT Analysis
        13.3.9    SÜSS MicroTec SE
           13.3.9.1 Company Overview
           13.3.9.2 Product Portfolio
           13.3.9.3 Financials
        13.3.10    Taiwan Semiconductor Manufacturing Company Limited 
           13.3.10.1 Company Overview
           13.3.10.2 Product Portfolio
           13.3.10.3 Financials
           13.3.10.4 SWOT Analysis
        13.3.11    Texas Instruments Incorporated
           13.3.11.1 Company Overview
           13.3.11.2 Product Portfolio
           13.3.11.3 Financials
           13.3.11.4 SWOT Analysis
        13.3.12    Universal Instruments Corporation (CBA Group Inc.)
           13.3.12.1 Company Overview
           13.3.12.2 Product Portfolio

List of Figures

Figure 1: Global: Advanced Packaging Market: Major Drivers and Challenges
Figure 2: Global: Advanced Packaging Market: Sales Value (in Billion US$), 2016-2021
Figure 3: Global: Advanced Packaging Market Forecast: Sales Value (in Billion US$), 2022-2027
Figure 4: Global: Advanced Packaging Market: Breakup by Type (in %), 2021
Figure 5: Global: Advanced Packaging Market: Breakup by End Use (in %), 2021
Figure 6: Global: Advanced Packaging Market: Breakup by Region (in %), 2021
Figure 7: Global: Advanced Packaging (Flip-Chip Ball Grid Array) Market: Sales Value (in Million US$), 2016 & 2021
Figure 8: Global: Advanced Packaging (Flip-Chip Ball Grid Array) Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 9: Global: Advanced Packaging (Flip Chip CSP) Market: Sales Value (in Million US$), 2016 & 2021
Figure 10: Global: Advanced Packaging (Flip Chip CSP) Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 11: Global: Advanced Packaging (Wafer Level CSP) Market: Sales Value (in Million US$), 2016 & 2021
Figure 12: Global: Advanced Packaging (Wafer Level CSP) Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 13: Global: Advanced Packaging (5D/3D) Market: Sales Value (in Million US$), 2016 & 2021
Figure 14: Global: Advanced Packaging (5D/3D) Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 15: Global: Advanced Packaging (Fan Out WLP) Market: Sales Value (in Million US$), 2016 & 2021
Figure 16: Global: Advanced Packaging (Fan Out WLP) Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 17: Global: Advanced Packaging (Other Types) Market: Sales Value (in Million US$), 2016 & 2021
Figure 18: Global: Advanced Packaging (Other Types) Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 19: Global: Advanced Packaging (Consumer Electronics) Market: Sales Value (in Million US$), 2016 & 2021
Figure 20: Global: Advanced Packaging (Consumer Electronics) Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 21: Global: Advanced Packaging (Automotive) Market: Sales Value (in Million US$), 2016 & 2021
Figure 22: Global: Advanced Packaging (Automotive) Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 23: Global: Advanced Packaging (Industrial) Market: Sales Value (in Million US$), 2016 & 2021
Figure 24: Global: Advanced Packaging (Industrial) Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 25: Global: Advanced Packaging (Healthcare) Market: Sales Value (in Million US$), 2016 & 2021
Figure 26: Global: Advanced Packaging (Healthcare) Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 27: Global: Advanced Packaging (Aerospace and Defense) Market: Sales Value (in Million US$), 2016 & 2021
Figure 28: Global: Advanced Packaging (Aerospace and Defense) Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 29: Global: Advanced Packaging (Other End Uses) Market: Sales Value (in Million US$), 2016 & 2021
Figure 30: Global: Advanced Packaging (Other End Uses) Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 31: North America: Advanced Packaging Market: Sales Value (in Million US$), 2016 & 2021
Figure 32: North America: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 33: United States: Advanced Packaging Market: Sales Value (in Million US$), 2016 & 2021
Figure 34: United States: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 35: Canada: Advanced Packaging Market: Sales Value (in Million US$), 2016 & 2021
Figure 36: Canada: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 37: Asia-Pacific: Advanced Packaging Market: Sales Value (in Million US$), 2016 & 2021
Figure 38: Asia-Pacific: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 39: China: Advanced Packaging Market: Sales Value (in Million US$), 2016 & 2021
Figure 40: China: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 41: Japan: Advanced Packaging Market: Sales Value (in Million US$), 2016 & 2021
Figure 42: Japan: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 43: India: Advanced Packaging Market: Sales Value (in Million US$), 2016 & 2021
Figure 44: India: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 45: South Korea: Advanced Packaging Market: Sales Value (in Million US$), 2016 & 2021
Figure 46: South Korea: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 47: Australia: Advanced Packaging Market: Sales Value (in Million US$), 2016 & 2021
Figure 48: Australia: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 49: Indonesia: Advanced Packaging Market: Sales Value (in Million US$), 2016 & 2021
Figure 50: Indonesia: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 51: Others: Advanced Packaging Market: Sales Value (in Million US$), 2016 & 2021
Figure 52: Others: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 53: Europe: Advanced Packaging Market: Sales Value (in Million US$), 2016 & 2021
Figure 54: Europe: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 55: Germany: Advanced Packaging Market: Sales Value (in Million US$), 2016 & 2021
Figure 56: Germany: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 57: France: Advanced Packaging Market: Sales Value (in Million US$), 2016 & 2021
Figure 58: France: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 59: United Kingdom: Advanced Packaging Market: Sales Value (in Million US$), 2016 & 2021
Figure 60: United Kingdom: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 61: Italy: Advanced Packaging Market: Sales Value (in Million US$), 2016 & 2021
Figure 62: Italy: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 63: Spain: Advanced Packaging Market: Sales Value (in Million US$), 2016 & 2021
Figure 64: Spain: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 65: Russia: Advanced Packaging Market: Sales Value (in Million US$), 2016 & 2021
Figure 66: Russia: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 67: Others: Advanced Packaging Market: Sales Value (in Million US$), 2016 & 2021
Figure 68: Others: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 69: Latin America: Advanced Packaging Market: Sales Value (in Million US$), 2016 & 2021
Figure 70: Latin America: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 71: Brazil: Advanced Packaging Market: Sales Value (in Million US$), 2016 & 2021
Figure 72: Brazil: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 73: Mexico: Advanced Packaging Market: Sales Value (in Million US$), 2016 & 2021
Figure 74: Mexico: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 75: Others: Advanced Packaging Market: Sales Value (in Million US$), 2016 & 2021
Figure 76: Others: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 77: Middle East and Africa: Advanced Packaging Market: Sales Value (in Million US$), 2016 & 2021
Figure 78: Middle East and Africa: Advanced Packaging Market: Breakup by Country (in %), 2021
Figure 79: Middle East and Africa: Advanced Packaging Market Forecast: Sales Value (in Million US$), 2022-2027
Figure 80: Global: Advanced Packaging Industry: SWOT Analysis
Figure 81: Global: Advanced Packaging Industry: Value Chain Analysis
Figure 82: Global: Advanced Packaging Industry: Porter's Five Forces Analysis

List of Tables

Table 1: Global: Advanced Packaging Market: Key Industry Highlights, 2021 and 2027
Table 2: Global: Advanced Packaging Market Forecast: Breakup by Type (in Million US$), 2022-2027
Table 3: Global: Advanced Packaging Market Forecast: Breakup by End Use (in Million US$), 2022-2027
Table 4: Global: Advanced Packaging Market Forecast: Breakup by Region (in Million US$), 2022-2027
Table 5: Global: Advanced Packaging Market: Competitive Structure
Table 6: Global: Advanced Packaging Market: Key Players


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