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The Asia Pacific chip mounter market is currently witnessing moderate growth. A chip mounter is a robotic device used to place mounted devices on printed circuit boards. The chip mounting technology resurfaced as surface mounting technology. However, surface mounting technology involves the placement of chips directly on PCBs without creating holes through the soldering process. The process helps manufacturers to save space and place more chips on the same board. Moreover, research and development have led to advancements in technology, resulting in the introduction of Fine Pitch technology that offers a higher circuit density compared to the surface mounted technology. Both these technologies are used by manufacturers to produce chips mounted on substrates.
The Asia Pacific chip mounter market is primarily driven by the well-established electronics manufacturing industry in China. Regional governments are also supporting the industry with the implementation of favorable regulations. Furthermore, the flourishing industrial market due to the ongoing push for safer and smart cities in the Asia Pacific region has induced the demand for semiconductors, especially in security, automation, solid-state lighting and transportation segments. On account of these factors, the market is expected to continue its moderate growth during the forecast period (2021-2026).
IMARC Group provides an analysis of the key trends in each sub-segment of the Asia Pacific chip mounter market report, along with forecasts for growth at the region level from 2021-2026. Our report has categorized the market based on region, technology and application.
Breakup by Technology:
Breakup by Application:
Breakup by Country:
The competitive landscape of the industry has also been examined along with the profiles of the key players.
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