The global hermetic packaging market size reached US$ 4.09 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 5.53 Billion by 2028, exhibiting a growth rate (CAGR) of 5.00% during 2023-2028. The rising product utilization in the aerospace and defense industry, widespread product applications across the automotive industry, and the recent development of laser hermetic sealing represent some of the key factors driving the market.
|Market Size in 2022||US$ 4.09 Billion|
|Market Forecast in 2028||US$ 5.53 Billion|
|Market Growth Rate (2023-2028)||
Hermetic packaging refers to a specialized enclosure or sealing technique that creates an airtight and impervious seal around electronic components or devices. It includes glass-to-glass, glass-to-metal, ceramic-to-metal, ceramic-to-glass, and epoxy seals. Hermetic packaging is widely used in satellites, aircraft, missiles, spacecraft, radars, electronic warfare devices, automotive electronics, data loggers, monitoring devices, pacemakers, and hearing aids. It is a highly durable and leak-proof product that ensures the integrity of the system, improves performance in extreme conditions, and protects from various environmental factors, such as moisture, gases, dust, and other contaminants. It also aids in enhancing equipment reliability, extending component lifespan, and minimizing the need for repairs, replacements, and maintenance. As a result, hermetic packaging finds extensive applications across the automotive, aerospace and defense, food and beverage (F&B), electrical and electronics, oil and gas, pharmaceutical, and chemical industries.
The rising product utilization in the aerospace and defense industry is one of the primary factors propelling the market growth. Hermetic packaging is widely used to protect communication systems, sensors, data recorders, avionics, flight controls, missile components, night vision devices, and power management systems in satellites, weapons, tanks, aircraft, radars, and unmanned aerial vehicles (UAVs). In addition to this, the implementation of supportive government policies toward military modernization and space exploration activities is acting as another growth-inducing factor. Furthermore, the widespread product application across the automotive industry to ensure the reliability and performance of various electronic components, such as advanced driver assistance systems (ADAS), motor control units, battery management systems, infotainment systems, airbag control units, anti-lock braking systems (ABS), electronic stability control (ESC), and power converters is providing an impetus to the market growth. Additionally, the recent development of laser hermetic sealing, which offers precise control, minimal heat input, and localized sealing, thus enabling the packaging of delicate and heat-sensitive components, is positively influencing the market growth. Besides this, the introduction of hermetic wafer-level packaging (WLP), which reduces costs, enhances production efficiency and enables the packaging of miniaturized electronic systems, is contributing to the market growth. Moreover, the widespread product utilization in the healthcare industry to protect implantable devices, diagnostic equipment, and sensors is favoring the market growth. Other factors, including the rising demand for miniaturized electronics, extensive research and development (R&D) activities, and the growing product utilization in renewable energy generation, are anticipated to drive the market growth.
IMARC Group provides an analysis of the key trends in each segment of the global hermetic packaging market report, along with forecasts at the global, regional, and country levels for 2023-2028. Our report has categorized the market based on type and application.
The report has provided a detailed breakup and analysis of the hermetic packaging market based on the type. This includes ceramic to metal, glass to metal, transponder glass, reed glass, and passivation glass. According to the report, ceramic to metal represented the largest segment.
A detailed breakup and analysis of the hermetic packaging market based on the application has also been provided in the report. This includes aeronautics and space, military and defense, automotive, healthcare, telecom, and others. According to the report, military and defense accounted for the largest market share.
The report has also provided a comprehensive analysis of all the major regional markets, which include North America (the United States and Canada); Europe (Germany, France, the United Kingdom, Italy, Spain, and others); Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others); Latin America (Brazil, Mexico, and others); and the Middle East and Africa. According to the report, Asia Pacific was the largest market for hermetic packaging. Some of the factors driving the Asia Pacific hermetic packaging market included rapid industrialization, supportive government policies, and various product innovations.
The report has also provided a comprehensive analysis of the competitive landscape in the global hermetic packaging market. Competitive analysis such as market structure, market share by key players, player positioning, top winning strategies, competitive dashboard, and company evaluation quadrant has been covered in the report. Also, detailed profiles of all major companies have been provided. Some of the companies covered include AMETEK Inc., CeramTec GmbH, Egide SA, KYOCERA Corporation, Legacy Technologies Inc., Materion Corporation, Micross Components LLC, Schott AG, Teledyne Technologies Incorporated, etc. Kindly note that this only represents a partial list of companies, and the complete list has been provided in the report.
|Base Year of the Analysis||2022|
|Scope of the Report||Exploration of Historical and Forecast Trends, Industry Catalysts and Challenges, Segment-Wise Historical and Predictive Market Assessment:
|Types Covered||Ceramic to Metal, Glass to Metal, Transponder Glass, Reed Glass, Passivation Glass|
|Applications Covered||Aeronautics and Space, Military and Defense, Automotive, Healthcare, Telecom, Others|
|Regions Covered||Asia Pacific, Europe, North America, Latin America, Middle East and Africa|
|Countries Covered||United States, Canada, Germany, France, United Kingdom, Italy, Spain, China, Japan, India, South Korea, Australia, Indonesia, Brazil, Mexico|
|Companies Covered||AMETEK Inc., CeramTec GmbH, Egide SA, KYOCERA Corporation, Legacy Technologies Inc., Materion Corporation, Micross Components LLC, Schott AG, Teledyne Technologies Incorporated, etc.|
|Customization Scope||10% Free Customization|
|Report Price and Purchase Option||Single User License: US$ 2499
Five User License: US$ 3499
Corporate License: US$ 4499
|Post-Sale Analyst Support||10-12 Weeks|
|Delivery Format||PDF and Excel through Email (We can also provide the editable version of the report in PPT/Word format on special request)|
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